Intel Arc A310 vs Intel Arc A770 Full Specs

Summary

768 Shaders 1.75GHz	4,096 Shaders 2.4GHz
4GB GDDR6124GB/s	8GB GDDR6512GB/s
Peak·FP32·FP16 2.69 TFLOPS	Peak·FP32·FP16 19.66 TFLOPS
Form Factor PCIe Card	Form Factor PCIe Card
TDP 75W	TDP 225W

Highlights

Peak OPS

Peak OPS FP32 FP16 Tensor FP16-32 FP64 Tensor BF16 Tensor INT8 Tensor INT4 Memory Bandwidth TDP

Arc A31086.02 TOPSINT4 Tensor

x1

Arc A770629.1 TOPSINT4 Tensor

x7.31

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Theoretical Performance

Clock Speed1750MHz UC·Base·Boost·OC	Clock Speed2400MHz UC·Base·Boost·OC
Peak OPS 86.02 TOPSINT4 Tensor	Peak OPS 629.1 TOPSINT4 Tensor
Tensor FP16-32 21.5 TFLOPS	Tensor FP16-32 157.3 TFLOPS
Tensor BF16 21.5 TFLOPS	Tensor BF16 157.3 TFLOPS
FP32 2.69 TFLOPS	FP32 19.66 TFLOPS
FP64 672 GFLOPS	FP64 4.92 TFLOPS
Tensor INT4 86.02 TOPS	Tensor INT4 629.1 TOPS
Tensor INT8 43.01 TOPS	Tensor INT8 314.6 TOPS
Pixel Rate 42 GPixel/s	Pixel Rate 307.2 GPixel/s
Texture Rate 84 GTexel/s	Texture Rate 614.4 GTexel/s

Core Config

Shaders 768 Shaders	Shaders 4,096 Shaders
TMUs 48 TMUs	TMUs 256 TMUs
ROPs 24 ROPs	ROPs 128 ROPs
Tensor Cores 96 T-Cores	Tensor Cores 512 T-Cores
RT Cores 6 RT-Cores	RT Cores 32 RT-Cores
EUs 96 EUs	EUs 512 EUs

Clocks

Base Clock 1.75GHz	Base Clock 2.1GHz
Boost Clock 1.75GHz	Boost Clock 2.4GHz

Cache

L2 Cache 4.1MB shared

L2 Cache 8.2MB shared

Memory

4GB GDDR6	8GB GDDR6
Memory Bus 64-bit	Memory Bus 256-bit
Memory Speed 15.5GT/s	Memory Speed 16GT/s
Memory Bandwidth 124GB/s	Memory Bandwidth 512GB/s

Power & Thermals

TDP 75W

TDP 225W

Video Output

Multi-Monitor 4

Multi-Monitor 4

Ports

-	3x DisplayPort 2.0
4x Mini DisplayPort 2.0	-
-	1x HDMI 2.1

Encoder

Encoder Model Arc

Encoder Model Arc

Decoder

Decoder Model Arc

Decoder Model Arc

Card

Form Factor PCIe Card	Form Factor PCIe Card
PCIe 1-Slots	PCIe 2-Slots
Height 69 mm (2.72") Width 168 mm (6.61") Depth 20 mm (0.79")	Height 98.4 mm (3.87") Width 279.9 mm (11.02") Depth 40 mm (1.57")
Cooling Blower 1x Fan	Cooling Open-Air 2x Fans

Chip

Manufacturer Intel	Manufacturer Intel
Chip Designer Intel	Chip Designer Intel
Architecture Alchemist	Architecture Alchemist
Family Arc A	Family Arc A
Branding	Branding
Codename Xe HPG	Codename Xe HPG
Chip Variant DG2-128	Chip Variant DG2-512
Market Segment Desktop	Market Segment Desktop
Release Date Sep 14, 2022	Release Date Oct 14, 2022

Fabrication

Foundry TSMC	Foundry TSMC
Fabrication Node N6	Fabrication Node N6
Die Size 157mm²	Die Size 406mm²
Transistor Count 7.2 Billion	Transistor Count 21.7 Billion
Transistor Density 45.86 MTr/mm²	Transistor Density 53.45 MTr/mm²

Images

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