GPUs

Intel Arc A350M vs Intel Arc A770M Full Specs

768 Shaders
1.15GHz
4,096 Shaders
1.65GHz
4GB GDDR6112GB/s
16GB GDDR6512GB/s
··
1.77 TFLOPS
··
13.52 TFLOPS
Form Factor
Soldered
Form Factor
Soldered
TDP
25W
TDP
120W

Arc A350MArc A350M56.52 TOPSINT4 Tensor
x1
Arc A770MArc A770M432.5 TOPSINT4 Tensor
x7.65

Clock Speed
···
Clock Speed
···
Peak OPS
56.52 TOPSINT4 Tensor
Peak OPS
432.5 TOPSINT4 Tensor
Tensor FP16-32
14.13 TFLOPS
Tensor FP16-32
108.1 TFLOPS
Tensor BF16
14.13 TFLOPS
Tensor BF16
108.1 TFLOPS
FP32
1.77 TFLOPS
FP32
13.52 TFLOPS
FP64
441.6 GFLOPS
FP64
3.38 TFLOPS
Tensor INT4
56.52 TOPS
Tensor INT4
432.5 TOPS
Tensor INT8
28.26 TOPS
Tensor INT8
216.3 TOPS
Pixel Rate
27.6 GPixel/s
Pixel Rate
211.2 GPixel/s
Texture Rate
55.2 GTexel/s
Texture Rate
422.4 GTexel/s

Shaders
768 Shaders
Shaders
4,096 Shaders
TMUs
48 TMUs
TMUs
256 TMUs
ROPs
24 ROPs
ROPs
128 ROPs
Tensor Cores
96 T-Cores
Tensor Cores
512 T-Cores
RT Cores
6 RT-Cores
RT Cores
32 RT-Cores
EUs
96 EUs
EUs
512 EUs

Base Clock
300MHz
Base Clock
300MHz
Boost Clock
1.15GHz
Boost Clock
1.65GHz

L2 Cache
4.1MB shared
L2 Cache
8.2MB shared

4GB GDDR6
16GB GDDR6
Memory Bus
64-bit
Memory Bus
256-bit
Memory Speed
14GT/s
Memory Speed
16GT/s
Memory Bandwidth
112GB/s
Memory Bandwidth
512GB/s

TDP
25W
TDP
120W

Multi-Monitor
4
Multi-Monitor
4

Encoder Model
Arc
Encoder Model
Arc

Decoder Model
Arc
Decoder Model
Arc

Form Factor
Soldered
Form Factor
Soldered

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
Arc branding
Branding
Arc branding
Codename
Xe HPG
Codename
Xe HPG
Chip Variant
DG2-128
Chip Variant
DG2-512
Market Segment
Laptop
Market Segment
Laptop
Release Date
Mar 30, 2022
Release Date
Jun 28, 2022

Foundry
TSMC
Foundry
TSMC
Fabrication Node
N6
Fabrication Node
N6
Die Size
157mm²
Die Size
406mm²
Transistor Count
7.2 Billion
Transistor Count
21.7 Billion
Transistor Density
45.86 MTr/mm²
Transistor Density
53.45 MTr/mm²

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