GPUs

Intel Arc A370M vs Apple 10-Core M3 Full Specs

1,024 Shaders
1.55GHz
1,280 Shaders
1.34GHz
4GB GDDR6112GB/s
Shared Memory102.4GB/sLPDDR5
··
3.17 TFLOPS
··
3.42 TFLOPS
Form Factor
Soldered
Form Factor
iGPU
TDP
35W
TDP
Shared

Arc A370MArc A370M101.6 TOPSINT4 Tensor
x29.66
10-Core M310-Core M33.42 TFLOPSFP16
x1

Clock Speed
···
Clock Speed
··
Peak OPS
101.6 TOPSINT4 Tensor
Peak OPS
3.42 TFLOPSFP16
Tensor FP16-32
25.4 TFLOPS
-
Tensor BF16
25.4 TFLOPS
-
FP32
3.17 TFLOPS
FP32
3.42 TFLOPS
FP64
793.6 GFLOPS
-
Tensor INT4
101.6 TOPS
Tensor INT4
-
Tensor INT8
50.79 TOPS
-
Pixel Rate
49.6 GPixel/s
Pixel Rate
53.5 GPixel/s
Texture Rate
99.2 GTexel/s
Texture Rate
107 GTexel/s

Shaders
1,024 Shaders
Shaders
1,280 Shaders
TMUs
64 TMUs
TMUs
80 TMUs
ROPs
32 ROPs
ROPs
40 ROPs
Tensor Cores
128 T-Cores
Tensor Cores
-
RT Cores
8 RT-Cores
RT Cores
10 RT-Cores
EUs
128 EUs
EUs
160 EUs

Base Clock
300MHz
Base Clock
-
Boost Clock
1.55GHz
Boost Clock
1.34GHz

L2 Cache
4.1MB shared
L2 Cache
2MB shared

4GB GDDR6
Shared MemoryLPDDR5
Memory Bus
64-bit
Memory Bus
128-bit
Memory Speed
14GT/s
Memory Speed
6.4GT/s
Memory Bandwidth
112GB/s
Memory Bandwidth
102.4GB/s
ECC
No
ECC
No

TDP
35W
TDP
Shared

Multi-Monitor
4
Multi-Monitor
1

Encoder Model
Arc
Encoder Model
Apple Media Engine 3

Decoder Model
Arc
Decoder Model
Apple Media Engine 3

Form Factor
Soldered
Form Factor
iGPU

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
Arc branding
Branding
M3 branding
Codename
Xe HPG
Codename
G15G
Chip Variant
DG2-128
Chip Variant
-
Market Segment
Laptop
Market Segment
Laptop
Release Date
Mar 30, 2022
Release Date
Oct 30, 2023

Foundry
TSMC
Foundry
TSMC
Fabrication Node
N6
Fabrication Node
N3B
Die Size
157mm²
Die Size
153mm²
Transistor Count
7.2 Billion
Transistor Count
25 Billion
Transistor Density
45.86 MTr/mm²
Transistor Density
164 MTr/mm²

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