Intel Arc A370M vs Apple 10-Core M3 Full Specs

Summary

1,024 Shaders 1.55GHz	1,280 Shaders 1.34GHz
4GB GDDR6112GB/s placeholder	Shared Memory102.4GB/sLPDDR5
Peak·FP32·FP16 3.17 TFLOPS	Peak·FP32·FP16 3.42 TFLOPS
Form Factor Soldered	Form Factor iGPU
TDP 35W	TDP Shared

Highlights

Peak OPS

Peak OPS FP32 FP16 Tensor FP16-32 FP64 Tensor BF16 Tensor INT8 Tensor INT4 Memory Bandwidth TDP

Arc A370M101.6 TOPSINT4 Tensor

x29.66

10-Core M33.42 TFLOPSFP16

x1

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Theoretical Performance

Clock Speed1550MHz UC·Base·Boost·OC	Clock Speed1338MHz UC·Boost·OC
Peak OPS 101.6 TOPSINT4 Tensor	Peak OPS 3.42 TFLOPSFP16
Tensor FP16-32 25.4 TFLOPS	-
Tensor BF16 25.4 TFLOPS	-
FP32 3.17 TFLOPS	FP32 3.42 TFLOPS
FP64 793.6 GFLOPS	-
Tensor INT4 101.6 TOPS	Tensor INT4 -
Tensor INT8 50.79 TOPS	-
Pixel Rate 49.6 GPixel/s	Pixel Rate 53.5 GPixel/s
Texture Rate 99.2 GTexel/s	Texture Rate 107 GTexel/s

Core Config

Shaders 1,024 Shaders	Shaders 1,280 Shaders
TMUs 64 TMUs	TMUs 80 TMUs
ROPs 32 ROPs	ROPs 40 ROPs
Tensor Cores 128 T-Cores	Tensor Cores -
RT Cores 8 RT-Cores	RT Cores 10 RT-Cores
EUs 128 EUs	EUs 160 EUs

Clocks

Base Clock 300MHz	Base Clock -
Boost Clock 1.55GHz	Boost Clock 1.34GHz

Cache

L2 Cache 4.1MB shared

L2 Cache 2MB shared

Memory

4GB GDDR6 placeholder	Shared MemoryLPDDR5
Memory Bus 64-bit	Memory Bus 128-bit
Memory Speed 14GT/s	Memory Speed 6.4GT/s
Memory Bandwidth 112GB/s	Memory Bandwidth 102.4GB/s
ECC No	ECC No

Power & Thermals

TDP 35W

TDP Shared

Video Output

Multi-Monitor 4

Multi-Monitor 1

Encoder

Encoder Model Arc

Encoder Model Apple Media Engine 3

Decoder

Decoder Model Arc

Decoder Model Apple Media Engine 3

Card

Form Factor Soldered

Form Factor iGPU

Chip

Manufacturer Intel	Manufacturer Apple
Chip Designer Intel	Chip Designer Apple
Architecture Alchemist	Architecture Apple Gen 6
Family Arc A	Family M Series
Branding	Branding
Codename Xe HPG	Codename G15G
Chip Variant DG2-128	Chip Variant -
Market Segment Laptop	Market Segment Laptop
Release Date Mar 30, 2022	Release Date Oct 30, 2023

Fabrication

Foundry TSMC	Foundry TSMC
Fabrication Node N6	Fabrication Node N3B
Die Size 157mm²	Die Size 153mm²
Transistor Count 7.2 Billion	Transistor Count 25 Billion
Transistor Density 45.86 MTr/mm²	Transistor Density 164 MTr/mm²

Images

No images available

No images available

Used In

CPUs -	CPUs M3 (8C10G)
Laptops XPS 15(9530, Early 2023)Envy 16(Early 2022)	Laptops MacBook Pro 14(M3, Late 2023)
All-in-Ones -	All-in-Ones iMac 24(M3, Four Ports, Late 2023)

Competitors

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