GPUs

Intel Arc A370M vs Intel Arc A550M Full Specs

1,024 Shaders
1.55GHz
2,048 Shaders
900MHz
4GB GDDR6112GB/s
8GB GDDR6224GB/s
··
3.17 TFLOPS
··
3.69 TFLOPS
Form Factor
Soldered
Form Factor
Soldered
TDP
35W
TDP
60W

Arc A370MArc A370M101.6 TOPSINT4 Tensor
x1
Arc A550MArc A550M118 TOPSINT4 Tensor
x1.16

Clock Speed
···
Clock Speed
···
Peak OPS
101.6 TOPSINT4 Tensor
Peak OPS
118 TOPSINT4 Tensor
Tensor FP16-32
25.4 TFLOPS
Tensor FP16-32
29.49 TFLOPS
Tensor BF16
25.4 TFLOPS
Tensor BF16
29.49 TFLOPS
FP32
3.17 TFLOPS
FP32
3.69 TFLOPS
FP64
793.6 GFLOPS
FP64
921.6 GFLOPS
Tensor INT4
101.6 TOPS
Tensor INT4
118 TOPS
Tensor INT8
50.79 TOPS
Tensor INT8
58.98 TOPS
Pixel Rate
49.6 GPixel/s
Pixel Rate
57.6 GPixel/s
Texture Rate
99.2 GTexel/s
Texture Rate
115.2 GTexel/s

Shaders
1,024 Shaders
Shaders
2,048 Shaders
TMUs
64 TMUs
TMUs
128 TMUs
ROPs
32 ROPs
ROPs
64 ROPs
Tensor Cores
128 T-Cores
Tensor Cores
256 T-Cores
RT Cores
8 RT-Cores
RT Cores
16 RT-Cores
EUs
128 EUs
EUs
256 EUs

Base Clock
300MHz
Base Clock
300MHz
Boost Clock
1.55GHz
Boost Clock
900MHz

L2 Cache
4.1MB shared
L2 Cache
8.2MB shared

4GB GDDR6
8GB GDDR6
Memory Bus
64-bit
Memory Bus
128-bit
Memory Speed
14GT/s
Memory Speed
14GT/s
Memory Bandwidth
112GB/s
Memory Bandwidth
224GB/s

TDP
35W
TDP
60W

Multi-Monitor
4
Multi-Monitor
4

Encoder Model
Arc
Encoder Model
Arc

Decoder Model
Arc
Decoder Model
Arc

Form Factor
Soldered
Form Factor
Soldered

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
Arc branding
Branding
Arc branding
Codename
Xe HPG
Codename
Xe HPG
Chip Variant
DG2-128
Chip Variant
DG2-512
Market Segment
Laptop
Market Segment
Laptop
Release Date
Mar 30, 2022
Release Date
Mar 30, 2022

Foundry
TSMC
Foundry
TSMC
Fabrication Node
N6
Fabrication Node
N6
Die Size
157mm²
Die Size
406mm²
Transistor Count
7.2 Billion
Transistor Count
21.7 Billion
Transistor Density
45.86 MTr/mm²
Transistor Density
53.45 MTr/mm²

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