GPUs

Intel Arc A370M vs Intel Arc A730M Full Specs

1,024 Shaders
1.55GHz
3,072 Shaders
1.1GHz
4GB GDDR6112GB/s
12GB GDDR6336GB/s
··
3.17 TFLOPS
··
6.76 TFLOPS
Form Factor
Soldered
Form Factor
Soldered
TDP
35W
TDP
80W

Arc A370MArc A370M101.6 TOPSINT4 Tensor
x1
Arc A730MArc A730M216.3 TOPSINT4 Tensor
x2.13

Clock Speed
···
Clock Speed
···
Peak OPS
101.6 TOPSINT4 Tensor
Peak OPS
216.3 TOPSINT4 Tensor
Tensor FP16-32
25.4 TFLOPS
Tensor FP16-32
54.07 TFLOPS
Tensor BF16
25.4 TFLOPS
Tensor BF16
54.07 TFLOPS
FP32
3.17 TFLOPS
FP32
6.76 TFLOPS
FP64
793.6 GFLOPS
FP64
1.69 TFLOPS
Tensor INT4
101.6 TOPS
Tensor INT4
216.3 TOPS
Tensor INT8
50.79 TOPS
Tensor INT8
108.1 TOPS
Pixel Rate
49.6 GPixel/s
Pixel Rate
105.6 GPixel/s
Texture Rate
99.2 GTexel/s
Texture Rate
211.2 GTexel/s

Shaders
1,024 Shaders
Shaders
3,072 Shaders
TMUs
64 TMUs
TMUs
192 TMUs
ROPs
32 ROPs
ROPs
96 ROPs
Tensor Cores
128 T-Cores
Tensor Cores
384 T-Cores
RT Cores
8 RT-Cores
RT Cores
24 RT-Cores
EUs
128 EUs
EUs
384 EUs

Base Clock
300MHz
Base Clock
300MHz
Boost Clock
1.55GHz
Boost Clock
1.1GHz

L2 Cache
4.1MB shared
L2 Cache
8.2MB shared

4GB GDDR6
12GB GDDR6
Memory Bus
64-bit
Memory Bus
192-bit
Memory Speed
14GT/s
Memory Speed
14GT/s
Memory Bandwidth
112GB/s
Memory Bandwidth
336GB/s

TDP
35W
TDP
80W

Multi-Monitor
4
Multi-Monitor
4

Encoder Model
Arc
Encoder Model
Arc

Decoder Model
Arc
Decoder Model
Arc

Form Factor
Soldered
Form Factor
Soldered

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
Arc branding
Branding
Arc branding
Codename
Xe HPG
Codename
Xe HPG
Chip Variant
DG2-128
Chip Variant
DG2-512
Market Segment
Laptop
Market Segment
Laptop
Release Date
Mar 30, 2022
Release Date
Jun 28, 2022

Foundry
TSMC
Foundry
TSMC
Fabrication Node
N6
Fabrication Node
N6
Die Size
157mm²
Die Size
406mm²
Transistor Count
7.2 Billion
Transistor Count
21.7 Billion
Transistor Density
45.86 MTr/mm²
Transistor Density
53.45 MTr/mm²

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