Intel Arc A370M vs NVIDIA GeForce RTX 3050 Laptop 80W Full Specs
1,024 Shaders 1.55GHz | 2,048 Shaders 1.74GHz |
4GB GDDR6112GB/s | 4GB GDDR6192GB/s |
·· 3.17 TFLOPS | ·· 7.13 TFLOPS |
Form Factor Soldered | Form Factor Soldered |
TDP 35W | TDP 80W |
Clock Speed ··· | Clock Speed ··· |
Peak OPS 101.6 TOPSINT4 Tensor | Peak OPS 228.1 TOPSINT4 Tensor Sparse |
Tensor FP16-16 -FP16-16 Tensor Sparse -Tensor FP16-32 25.4 TFLOPSFP16-32 Tensor Sparse - | Tensor FP16-16 28.51 TFLOPSFP16-16 Tensor Sparse 57.02 TFLOPSTensor FP16-32 14.25 TFLOPSFP16-32 Tensor Sparse 28.51 TFLOPS |
BF16 -Tensor BF16 25.4 TFLOPSBF16 Tensor Sparse - | BF16 7.13 TFLOPSTensor BF16 14.25 TFLOPSBF16 Tensor Sparse 28.51 TFLOPS |
Tensor TF32 - | Tensor TF32 7.13 TFLOPS |
FP32 3.17 TFLOPS | FP32 7.13 TFLOPS |
FP64 793.6 GFLOPS | FP64 111.4 GFLOPS |
Tensor INT4 101.6 TOPS | Tensor INT4 114 TOPS |
Tensor INT8 50.79 TOPS | Tensor INT8 57.02 TOPS |
Ray - | Ray 10.75 TOPS |
Pixel Rate 49.6 GPixel/s | Pixel Rate 55.7 GPixel/s |
Texture Rate 99.2 GTexel/s | Texture Rate 111.4 GTexel/s |
Shaders 1,024 Shaders | Shaders 2,048 Shaders |
TMUs 64 TMUs | TMUs 64 TMUs |
ROPs 32 ROPs | ROPs 32 ROPs |
Tensor Cores 128 T-Cores | Tensor Cores 64 T-Cores |
RT Cores 8 RT-Cores | RT Cores 16 RT-Cores |
EUs 128 EUs | SMs 16 SMs |
Base Clock 300MHz | Base Clock 1.49GHz |
Boost Clock 1.55GHz | Boost Clock 1.74GHz |
L1 - | L1 64KB/SM Tex |
L2 Cache 4MB shared | L2 Cache 2MB shared |
4GB GDDR6 | 4GB GDDR6 |
Memory Bus 64-bit | Memory Bus 128-bit |
Memory Speed 14GT/s | Memory Speed 12GT/s |
Memory Bandwidth 112GB/s | Memory Bandwidth 192GB/s |
ECC No | ECC No |
TDP 35W | TDP 80W |
Max Resolution 7680x4320 | Max Resolution 7680x4320 |
Refresh Rate Calculator 7680x4320 Resolution8K UHD Refresh Rate 60Hz | Refresh Rate Calculator 7680x4320 Resolution8K UHD Refresh Rate 60Hz |
Multi-Monitor 4 | Multi-Monitor 3 |
Adaptive Sync - FreeSync | Adaptive Sync G-Sync FreeSync |
DSC Not Supported | DSC Supported |
HDCP - | HDCP HDCP 2.3 |
Shader Model 6.6 | Shader Model 6.6 |
DirectX DirectX 12Direct3D 12_2 | DirectX DirectX 12Direct3D 12_2 |
OpenGL 4.6OpenCL 3Vulkan 1.3 | OpenGL 4.6OpenCL 3Vulkan 1.2 |
- | CUDA 8.6PureVideo HD VP11VDPAU Feature Set K |
Encoder Arc | Encoder NVENC 7 |
Codec AVC (H.264) HEVC (H.265) AV1 | Codec AVC (H.264) HEVC (H.265) - |
Decoder Arc | Decoder NVDEC 5 |
Codec - MPEG-2 - JPEG - - VP9 AVC (H.264) HEVC (H.265) AV1 | Codec MPEG-1 MPEG-2 MPEG-4 - VC-1 VP8 VP9 AVC (H.264) HEVC (H.265) AV1 |
Form Factor Soldered | Form Factor Soldered |
PCIe PCIe 4.0 x8 | PCIe PCIe 4.0 x8 |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename Xe HPG | Codename NV177 |
Chip Variant DG2-128 | Chip Variant GA107-140-A1 |
Market Segment Laptop | Market Segment Laptop |
Release Date Mar 30, 2022 | Release Date May 11, 2021 |
Foundry TSMC | Foundry Samsung |
Fabrication Node N6 | Fabrication Node 8N |
Die Size 157mm² | Die Size 200mm² |
Transistor Count 7.2B | Transistor Count 8.7B |
Transistor Density 45.86 MTr/mm² | Transistor Density 43.5 MTr/mm² |





