GPUs

Intel Arc A370M vs NVIDIA GeForce RTX 3060 Laptop 95W Full Specs

1,024 Shaders
1.55GHz
3,840 Shaders
1.57GHz
4GB GDDR6112GB/s
6GB GDDR6336GB/s
··
3.17 TFLOPS
··
12.03 TFLOPS
Form Factor
Soldered
Form Factor
Soldered
TDP
35W
TDP
95W

Clock Speed
···
Clock Speed
···
Peak OPS
101.6 TOPSINT4 Tensor
Peak OPS
385.1 TOPSINT4 Tensor Sparse
Tensor FP16-16
-
FP16-16 Tensor Sparse
-
Tensor FP16-32
25.4 TFLOPS
FP16-32 Tensor Sparse
-
Tensor FP16-16
48.14 TFLOPS
FP16-16 Tensor Sparse
96.28 TFLOPS
Tensor FP16-32
24.07 TFLOPS
FP16-32 Tensor Sparse
48.14 TFLOPS
BF16
-
Tensor BF16
25.4 TFLOPS
BF16 Tensor Sparse
-
BF16
12.03 TFLOPS
Tensor BF16
24.07 TFLOPS
BF16 Tensor Sparse
48.14 TFLOPS
Tensor TF32
-
Tensor TF32
12.03 TFLOPS
FP32
3.17 TFLOPS
FP32
12.03 TFLOPS
FP64
793.6 GFLOPS
FP64
188 GFLOPS
Tensor INT4
101.6 TOPS
Tensor INT4
192.6 TOPS
Tensor INT8
50.79 TOPS
Tensor INT8
96.28 TOPS
Ray
-
Ray
18.15 TOPS
Pixel Rate
49.6 GPixel/s
Pixel Rate
75.2 GPixel/s
Texture Rate
99.2 GTexel/s
Texture Rate
188 GTexel/s

Shaders
1,024 Shaders
Shaders
3,840 Shaders
TMUs
64 TMUs
TMUs
120 TMUs
ROPs
32 ROPs
ROPs
48 ROPs
Tensor Cores
128 T-Cores
Tensor Cores
120 T-Cores
RT Cores
8 RT-Cores
RT Cores
30 RT-Cores
EUs
128 EUs
SMs
30 SMs

Base Clock
300MHz
Base Clock
1.22GHz
Boost Clock
1.55GHz
Boost Clock
1.57GHz

L2 Cache
4MB shared
L2 Cache
3MB shared

4GB GDDR6
6GB GDDR6
Memory Bus
64-bit
Memory Bus
192-bit
Memory Speed
14GT/s
Memory Speed
14GT/s
Memory Bandwidth
112GB/s
Memory Bandwidth
336GB/s
ECC
No
ECC
No

TDP
35W
TDP
95W

Multi-Monitor
4
Multi-Monitor
3
HDCP
-
HDCP
HDCP 2.3

Encoder Model
Arc
Encoder Model
NVENC 7
Codec
AVC (H.264)
HEVC (H.265)
AV1
Codec
AVC (H.264)
HEVC (H.265)
-

Decoder Model
Arc
Decoder Model
NVDEC 5
Codec
-
MPEG-2
-
JPEG
-
-
VP9
AVC (H.264)
HEVC (H.265)
AV1
Codec
MPEG-1
MPEG-2
MPEG-4
-
VC-1
VP8
VP9
AVC (H.264)
HEVC (H.265)
AV1

Form Factor
Soldered
Form Factor
Soldered

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
Arc branding
Branding
GeForce RTX 2018 branding
Codename
Xe HPG
Codename
NV176
Chip Variant
DG2-128
Chip Variant
GA106-150-KA-A1
Market Segment
Laptop
Market Segment
Laptop
Release Date
Mar 30, 2022
Release Date
Feb 25, 2021

Foundry
TSMC
Foundry
Samsung
Fabrication Node
N6
Fabrication Node
8N
Die Size
157mm²
Die Size
276mm²
Transistor Count
7.2 Billion
Transistor Count
13.3 Billion
Transistor Density
45.86 MTr/mm²
Transistor Density
48.01 MTr/mm²