Intel Arc A380 vs NVIDIA GeForce RTX 3050 GA106 Full Specs
1,024 Shaders 2.45GHz | 2,560 Shaders 1.78GHz |
6GB GDDR6186.1GB/s | 8GB GDDR6224GB/s |
·· 5.02 TFLOPS | ·· 9.1 TFLOPS |
Form Factor PCIe Card | Form Factor PCIe Card |
TDP 75W | TDP 130W |
Power Connectors - | Power Connectors 1x 8-Pin |
Clock Speed ··· | Clock Speed ··· |
Peak OPS 160.6 TOPSINT4 Tensor | Peak OPS 291.1 TOPSINT4 Tensor Sparse |
Tensor FP16-16 -FP16-16 Tensor Sparse -Tensor FP16-32 40.14 TFLOPSFP16-32 Tensor Sparse - | Tensor FP16-16 36.39 TFLOPSFP16-16 Tensor Sparse 72.79 TFLOPSTensor FP16-32 18.2 TFLOPSFP16-32 Tensor Sparse 36.39 TFLOPS |
BF16 -Tensor BF16 40.14 TFLOPSBF16 Tensor Sparse - | BF16 9.1 TFLOPSTensor BF16 18.2 TFLOPSBF16 Tensor Sparse 36.39 TFLOPS |
Tensor TF32 - | Tensor TF32 9.1 TFLOPS |
FP32 5.02 TFLOPS | FP32 9.1 TFLOPS |
FP64 1.25 TFLOPS | FP64 142.2 GFLOPS |
Tensor INT4 160.6 TOPS | Tensor INT4 145.6 TOPS |
Tensor INT8 80.28 TOPS | Tensor INT8 72.79 TOPS |
Ray - | Ray 13.72 TOPS |
Pixel Rate 78.4 GPixel/s | Pixel Rate 85.3 GPixel/s |
Texture Rate 156.8 GTexel/s | Texture Rate 142.2 GTexel/s |
Shaders 1,024 Shaders | Shaders 2,560 Shaders |
TMUs 64 TMUs | TMUs 80 TMUs |
ROPs 32 ROPs | ROPs 48 ROPs |
Tensor Cores 128 T-Cores | Tensor Cores 80 T-Cores |
RT Cores 8 RT-Cores | RT Cores 20 RT-Cores |
EUs 128 EUs | SMs 20 SMs |
Base Clock 2GHz | Base Clock 1.55GHz |
Boost Clock 2.45GHz | Boost Clock 1.78GHz |
L2 Cache 4.1MB shared | L2 Cache 3.1MB shared |
6GB GDDR6 | 8GB GDDR6 |
Memory Bus 96-bit | Memory Bus 128-bit |
Memory Speed 15.5GT/s | Memory Speed 14GT/s |
Memory Bandwidth 186.1GB/s | Memory Bandwidth 224GB/s |
ECC No | ECC No |
TDP 75W | TDP 130W |
Max Temp - | Max Temp 93°C Max |
Multi-Monitor 4 | Multi-Monitor 4 |
HDCP - | HDCP HDCP 2.3 |
3x DisplayPort 2.0 | - |
- | 3x DisplayPort 1.4 |
1x HDMI 2.1 | 1x HDMI 2.1 |
Encoder Model Arc | Encoder Model NVENC 7 |
Decoder Model Arc | Decoder Model NVDEC 5 |
Form Factor PCIe Card | Form Factor PCIe Card |
PCIe 2.1-Slots | PCIe 1.9-Slots |
Height 114 mm (4.49")Width 222 mm (8.74")Depth 42 mm (1.65") | Height 112 mm (4.41")Width 242 mm (9.53")Depth 38 mm (1.5") |
Cooling Open-Air 1x Fan | Cooling Open-Air 2x Fans |
Power Connectors - | Power Connectors 1x 8-Pin |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename Xe HPG | Codename NV176 |
Chip Variant DG2-128 | Chip Variant GA106-150-KA-A1 |
Market Segment Desktop | Market Segment Desktop |
Release Date Jun 28, 2022 | Release Date Jan 27, 2022 |
Foundry TSMC | Foundry Samsung |
Fabrication Node N6 | Fabrication Node 8N |
Die Size 157mm² | Die Size 276mm² |
Transistor Count 7.2 Billion | Transistor Count 13.3 Billion |
Transistor Density 45.86 MTr/mm² | Transistor Density 48.01 MTr/mm² |
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