Intel Arc A380 vs NVIDIA GeForce RTX 3050 Laptop 40W Full Specs
1,024 Shaders 2.45GHz | 2,048 Shaders 1.22GHz |
6GB GDDR6186.1GB/s | 4GB GDDR6192GB/s |
·· 5.02 TFLOPS | ·· 5.01 TFLOPS |
Form Factor PCIe Card | Form Factor Soldered |
TDP 75W | TDP 40W |
Clock Speed ··· | Clock Speed ··· |
Peak OPS 160.6 TOPSINT4 Tensor | Peak OPS 160.3 TOPSINT4 Tensor Sparse |
Tensor FP16-16 -FP16-16 Tensor Sparse -Tensor FP16-32 40.14 TFLOPSFP16-32 Tensor Sparse - | Tensor FP16-16 20.04 TFLOPSFP16-16 Tensor Sparse 40.08 TFLOPSTensor FP16-32 10.02 TFLOPSFP16-32 Tensor Sparse 20.04 TFLOPS |
BF16 -Tensor BF16 40.14 TFLOPSBF16 Tensor Sparse - | BF16 5.01 TFLOPSTensor BF16 10.02 TFLOPSBF16 Tensor Sparse 20.04 TFLOPS |
Tensor TF32 - | Tensor TF32 5.01 TFLOPS |
FP32 5.02 TFLOPS | FP32 5.01 TFLOPS |
FP64 1.25 TFLOPS | FP64 78.27 GFLOPS |
Tensor INT4 160.6 TOPS | Tensor INT4 80.15 TOPS |
Tensor INT8 80.28 TOPS | Tensor INT8 40.08 TOPS |
Ray - | Ray 7.55 TOPS |
Pixel Rate 78.4 GPixel/s | Pixel Rate 39.1 GPixel/s |
Texture Rate 156.8 GTexel/s | Texture Rate 78.3 GTexel/s |
Shaders 1,024 Shaders | Shaders 2,048 Shaders |
TMUs 64 TMUs | TMUs 64 TMUs |
ROPs 32 ROPs | ROPs 32 ROPs |
Tensor Cores 128 T-Cores | Tensor Cores 64 T-Cores |
RT Cores 8 RT-Cores | RT Cores 16 RT-Cores |
EUs 128 EUs | SMs 16 SMs |
Base Clock 2GHz | Base Clock 938MHz |
Boost Clock 2.45GHz | Boost Clock 1.22GHz |
L2 Cache 4MB shared | L2 Cache 2MB shared |
6GB GDDR6 | 4GB GDDR6 |
Memory Bus 96-bit | Memory Bus 128-bit |
Memory Speed 15.5GT/s | Memory Speed 12GT/s |
Memory Bandwidth 186.1GB/s | Memory Bandwidth 192GB/s |
ECC No | ECC No |
TDP 75W | TDP 40W |
Multi-Monitor 4 | Multi-Monitor 3 |
HDCP - | HDCP HDCP 2.3 |
3x DisplayPort 2.0 1x HDMI 2.1 | - |
Encoder Model Arc | Encoder Model NVENC 7 |
Codec AVC (H.264) HEVC (H.265) AV1 | Codec AVC (H.264) HEVC (H.265) - |
Decoder Model Arc | Decoder Model NVDEC 5 |
Codec - MPEG-2 - JPEG - - VP9 AVC (H.264) HEVC (H.265) AV1 | Codec MPEG-1 MPEG-2 MPEG-4 - VC-1 VP8 VP9 AVC (H.264) HEVC (H.265) AV1 |
Form Factor PCIe Card | Form Factor Soldered |
PCIe 2.1-Slots | PCIe - |
Height 114 mm (4.49")Width 222 mm (8.74")Depth 42 mm (1.65") | - |
Cooling Open-Air 1x Fan | Cooling Open-Air - |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename Xe HPG | Codename NV177 |
Chip Variant DG2-128 | Chip Variant GA107-140-A1 |
Market Segment Desktop | Market Segment Laptop |
Release Date Jun 28, 2022 | Release Date May 11, 2021 |
Foundry TSMC | Foundry Samsung |
Fabrication Node N6 | Fabrication Node 8N |
Die Size 157mm² | Die Size 200mm² |
Transistor Count 7.2 Billion | Transistor Count 8.7 Billion |
Transistor Density 45.86 MTr/mm² | Transistor Density 43.5 MTr/mm² |

