GPUs

Intel Arc A380 vs NVIDIA GeForce RTX 3050 Ti Laptop 80W Full Specs

1,024 Shaders
2.45GHz
2,560 Shaders
1.7GHz
6GB GDDR6186.1GB/s
4GB GDDR6192GB/s
··
5.02 TFLOPS
··
8.68 TFLOPS
Form Factor
PCIe Card
Form Factor
Soldered
TDP
75W
TDP
80W

Clock Speed
···
Clock Speed
···
Peak OPS
160.6 TOPSINT4 Tensor
Peak OPS
277.7 TOPSINT4 Tensor Sparse
Tensor FP16-16
-
FP16-16 Tensor Sparse
-
Tensor FP16-32
40.14 TFLOPS
FP16-32 Tensor Sparse
-
Tensor FP16-16
34.71 TFLOPS
FP16-16 Tensor Sparse
69.43 TFLOPS
Tensor FP16-32
17.36 TFLOPS
FP16-32 Tensor Sparse
34.71 TFLOPS
BF16
-
Tensor BF16
40.14 TFLOPS
BF16 Tensor Sparse
-
BF16
8.68 TFLOPS
Tensor BF16
17.36 TFLOPS
BF16 Tensor Sparse
34.71 TFLOPS
Tensor TF32
-
Tensor TF32
8.68 TFLOPS
FP32
5.02 TFLOPS
FP32
8.68 TFLOPS
FP64
1.25 TFLOPS
FP64
135.6 GFLOPS
Tensor INT4
160.6 TOPS
Tensor INT4
138.9 TOPS
Tensor INT8
80.28 TOPS
Tensor INT8
69.43 TOPS
Ray
-
Ray
13.09 TOPS
Pixel Rate
78.4 GPixel/s
Pixel Rate
54.2 GPixel/s
Texture Rate
156.8 GTexel/s
Texture Rate
135.6 GTexel/s

Shaders
1,024 Shaders
Shaders
2,560 Shaders
TMUs
64 TMUs
TMUs
80 TMUs
ROPs
32 ROPs
ROPs
32 ROPs
Tensor Cores
128 T-Cores
Tensor Cores
80 T-Cores
RT Cores
8 RT-Cores
RT Cores
20 RT-Cores
EUs
128 EUs
SMs
20 SMs

Base Clock
2GHz
Base Clock
1.46GHz
Boost Clock
2.45GHz
Boost Clock
1.7GHz

L2 Cache
4MB shared
L2 Cache
2MB shared

6GB GDDR6
4GB GDDR6
Memory Bus
96-bit
Memory Bus
128-bit
Memory Speed
15.5GT/s
Memory Speed
12GT/s
Memory Bandwidth
186.1GB/s
Memory Bandwidth
192GB/s
ECC
No
ECC
No

TDP
75W
TDP
80W

Multi-Monitor
4
Multi-Monitor
3
HDCP
-
HDCP
HDCP 2.3

3x DisplayPort 2.0
1x HDMI 2.1
-

Encoder Model
Arc
Encoder Model
NVENC 7
Codec
AVC (H.264)
HEVC (H.265)
AV1
Codec
AVC (H.264)
HEVC (H.265)
-

Decoder Model
Arc
Decoder Model
NVDEC 5
Codec
-
MPEG-2
-
JPEG
-
-
VP9
AVC (H.264)
HEVC (H.265)
AV1
Codec
MPEG-1
MPEG-2
MPEG-4
-
VC-1
VP8
VP9
AVC (H.264)
HEVC (H.265)
AV1

Form Factor
PCIe Card
Form Factor
Soldered
PCIe
2.1-Slots
PCIe
-
Height
114 mm (4.49")
Width
222 mm (8.74")
Depth
42 mm (1.65")
-
Cooling
Open-Air
1x Fan
Cooling
Open-Air
-

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
Arc branding
Branding
GeForce RTX 2018 branding
Codename
Xe HPG
Codename
NV177
Chip Variant
DG2-128
Chip Variant
GA107-140-A1
Market Segment
Desktop
Market Segment
Laptop
Release Date
Jun 28, 2022
Release Date
May 11, 2021

Foundry
TSMC
Foundry
Samsung
Fabrication Node
N6
Fabrication Node
8N
Die Size
157mm²
Die Size
200mm²
Transistor Count
7.2 Billion
Transistor Count
8.7 Billion
Transistor Density
45.86 MTr/mm²
Transistor Density
43.5 MTr/mm²