GPUs

Intel Arc A550M vs Intel Arc A570M Full Specs

2,048 Shaders
900MHz
2,048 Shaders
1.3GHz
8GB GDDR6224GB/s
8GB GDDR6256GB/s
··
3.69 TFLOPS
··
5.33 TFLOPS
Form Factor
Soldered
Form Factor
Soldered
TDP
60W
TDP
75W

Arc A550MArc A550M118 TOPSINT4 Tensor
x1
Arc A570MArc A570M170.4 TOPSINT4 Tensor
x1.44

Clock Speed
···
Clock Speed
···
Peak OPS
118 TOPSINT4 Tensor
Peak OPS
170.4 TOPSINT4 Tensor
Tensor FP16-32
29.49 TFLOPS
Tensor FP16-32
42.6 TFLOPS
Tensor BF16
29.49 TFLOPS
Tensor BF16
42.6 TFLOPS
FP32
3.69 TFLOPS
FP32
5.33 TFLOPS
FP64
921.6 GFLOPS
FP64
1.33 TFLOPS
Tensor INT4
118 TOPS
Tensor INT4
170.4 TOPS
Tensor INT8
58.98 TOPS
Tensor INT8
85.2 TOPS
Pixel Rate
57.6 GPixel/s
Pixel Rate
83.2 GPixel/s
Texture Rate
115.2 GTexel/s
Texture Rate
166.4 GTexel/s

Shaders
2,048 Shaders
Shaders
2,048 Shaders
TMUs
128 TMUs
TMUs
128 TMUs
ROPs
64 ROPs
ROPs
64 ROPs
Tensor Cores
256 T-Cores
Tensor Cores
256 T-Cores
RT Cores
16 RT-Cores
RT Cores
16 RT-Cores
EUs
256 EUs
EUs
256 EUs

Base Clock
300MHz
Base Clock
300MHz
Boost Clock
900MHz
Boost Clock
1.3GHz

L2 Cache
8.2MB shared
L2 Cache
8.2MB shared

8GB GDDR6
8GB GDDR6
Memory Bus
128-bit
Memory Bus
128-bit
Memory Speed
14GT/s
Memory Speed
16GT/s
Memory Bandwidth
224GB/s
Memory Bandwidth
256GB/s

TDP
60W
TDP
75W

Multi-Monitor
4
Multi-Monitor
4

Encoder Model
Arc
Encoder Model
Arc

Decoder Model
Arc
Decoder Model
Arc

Form Factor
Soldered
Form Factor
Soldered

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
Arc branding
Branding
Arc branding
Codename
Xe HPG
Codename
Xe HPG
Chip Variant
DG2-512
Chip Variant
DG2-256
Market Segment
Laptop
Market Segment
Laptop
Release Date
Mar 30, 2022
Release Date
Aug 1, 2023

Foundry
TSMC
Foundry
TSMC
Fabrication Node
N6
Fabrication Node
N6
Die Size
406mm²
Die Size
269mm²
Transistor Count
21.7 Billion
Transistor Count
11.5 Billion
Transistor Density
53.45 MTr/mm²
Transistor Density
42.75 MTr/mm²

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