Intel Arc A570M Full Specs

Summary

2,048 Shaders 1.3GHz

8GB GDDR6256GB/s

Peak·FP32·FP16 5.33 TFLOPS

Form Factor Soldered

TDP 75W

Highlights

Peak OPS

Peak OPS FP32 FP16 Tensor FP16-32 FP64 Tensor BF16 Tensor INT8 Tensor INT4 Memory Bandwidth

Arc A570M170.4 TOPSINT4 Tensor

x1

Top Score3.35 PFLOPS FP4 Tensor Sparse

x19.67

Desktop1xGeForce RTX 5090

Theoretical Performance

Clock Speed1300MHz UC·Base·Boost·OC

Peak OPS 170.4 TOPSINT4 Tensor

FP16 10.65 TFLOPS Tensor FP16-32 42.6 TFLOPS

Tensor BF16 42.6 TFLOPS

FP32 5.33 TFLOPS

FP64 1.33 TFLOPS

Tensor INT4 170.4 TOPS

Tensor INT8 85.2 TOPS

Pixel Rate 83.2 GPixel/s

Texture Rate 166.4 GTexel/s

Core Config

Shaders 2,048 Shaders

TMUs 128 TMUs

ROPs 64 ROPs

Tensor Cores 256 T-Cores

RT Cores 16 RT-Cores

EUs 256 EUs

Clocks

Base Clock 300MHz

Boost Clock 1.3GHz

Cache

L2 Cache 8MB shared

Memory

8GB GDDR6

Memory Bus 128-bit

Memory Speed 16GT/s

Memory Bandwidth 256GB/s

ECC No

Power & Thermals

TDP 75W

Video Output

Max Resolution 7680x4320

Refresh Rate Calculator 7680x4320 Resolution8K UHD Refresh Rate 60Hz

Multi-Monitor 4

Adaptive Sync FreeSync

DSC Not Supported

API Support

Shader Model 6.6

DirectX DirectX 12 Direct3D 12_2

OpenGL 4.6 OpenCL 3 Vulkan 1.3

Encoder

Encoder Arc

Codec JPEG VP9 AVC (H.264) HEVC (H.265) AV1

Decoder

Decoder Arc

Codec MPEG-2 JPEG VP9 AVC (H.264) HEVC (H.265) AV1

Card

Form Factor Soldered

PCIe PCIe 4.0 x16

Chip

Manufacturer Intel

Chip Designer Intel

Architecture Alchemist

Family Arc A

Branding

Codename Xe HPG

Chip Variant DG2-256

Market Segment Laptop

Release Date Aug 1, 2023

Fabrication

Foundry TSMC

Fabrication Node N6

Die Size 269mm²

Transistor Count 11.5B

Transistor Density 42.75 MTr/mm²

Images