GPUs

Intel Arc A570M vs Intel Arc A730M Full Specs

2,048 Shaders
1.3GHz
3,072 Shaders
1.1GHz
8GB GDDR6256GB/s
12GB GDDR6336GB/s
··
5.33 TFLOPS
··
6.76 TFLOPS
Form Factor
Soldered
Form Factor
Soldered
TDP
75W
TDP
80W

Arc A570MArc A570M170.4 TOPSINT4 Tensor
x1
Arc A730MArc A730M216.3 TOPSINT4 Tensor
x1.27

Clock Speed
···
Clock Speed
···
Peak OPS
170.4 TOPSINT4 Tensor
Peak OPS
216.3 TOPSINT4 Tensor
Tensor FP16-32
42.6 TFLOPS
Tensor FP16-32
54.07 TFLOPS
Tensor BF16
42.6 TFLOPS
Tensor BF16
54.07 TFLOPS
FP32
5.33 TFLOPS
FP32
6.76 TFLOPS
FP64
1.33 TFLOPS
FP64
1.69 TFLOPS
Tensor INT4
170.4 TOPS
Tensor INT4
216.3 TOPS
Tensor INT8
85.2 TOPS
Tensor INT8
108.1 TOPS
Pixel Rate
83.2 GPixel/s
Pixel Rate
105.6 GPixel/s
Texture Rate
166.4 GTexel/s
Texture Rate
211.2 GTexel/s

Shaders
2,048 Shaders
Shaders
3,072 Shaders
TMUs
128 TMUs
TMUs
192 TMUs
ROPs
64 ROPs
ROPs
96 ROPs
Tensor Cores
256 T-Cores
Tensor Cores
384 T-Cores
RT Cores
16 RT-Cores
RT Cores
24 RT-Cores
EUs
256 EUs
EUs
384 EUs

Base Clock
300MHz
Base Clock
300MHz
Boost Clock
1.3GHz
Boost Clock
1.1GHz

L2 Cache
8.2MB shared
L2 Cache
8.2MB shared

8GB GDDR6
12GB GDDR6
Memory Bus
128-bit
Memory Bus
192-bit
Memory Speed
16GT/s
Memory Speed
14GT/s
Memory Bandwidth
256GB/s
Memory Bandwidth
336GB/s

TDP
75W
TDP
80W

Multi-Monitor
4
Multi-Monitor
4

Encoder Model
Arc
Encoder Model
Arc

Decoder Model
Arc
Decoder Model
Arc

Form Factor
Soldered
Form Factor
Soldered

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
Arc branding
Branding
Arc branding
Codename
Xe HPG
Codename
Xe HPG
Chip Variant
DG2-256
Chip Variant
DG2-512
Market Segment
Laptop
Market Segment
Laptop
Release Date
Aug 1, 2023
Release Date
Jun 28, 2022

Foundry
TSMC
Foundry
TSMC
Fabrication Node
N6
Fabrication Node
N6
Die Size
269mm²
Die Size
406mm²
Transistor Count
11.5 Billion
Transistor Count
21.7 Billion
Transistor Density
42.75 MTr/mm²
Transistor Density
53.45 MTr/mm²

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