Intel Arc A580E vs Intel UHD 770 1660MHz Full Specs

Summary

3,072 Shaders -	256 Shaders 1.66GHz
16GB GDDR6560GB/s placeholder	Shared Memory89.6GB/s DDR5·DDR4
Peak·FP32·FP16 -	Peak·FP32·FP16 849.9 GFLOPS
Form Factor PCIe Card	Form Factor iGPU
TDP 185W	TDP Shared

Highlights

Peak OPS

Peak OPS FP32 FP16 FP64 Memory Bandwidth TDP

Arc A580E-

-

UHD 770 1660MHz1.7 TFLOPSFP16

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Theoretical Performance

-	Clock Speed1660MHz UC·Base·Boost·OC
Peak OPS -	Peak OPS 1.7 TFLOPSFP16
-	FP32 849.9 GFLOPS
-	FP64 212.5 GFLOPS
Pixel Rate -	Pixel Rate 13.3 GPixel/s
Texture Rate -	Texture Rate 26.6 GTexel/s

Core Config

Shaders 3,072 Shaders	Shaders 256 Shaders
TMUs 192 TMUs	TMUs 16 TMUs
ROPs 96 ROPs	ROPs 8 ROPs
Tensor Cores 384 T-Cores	Tensor Cores -
RT Cores 24 RT-Cores	RT Cores -
EUs 384 EUs	EUs 32 EUs

Clocks

Base Clock 1.7GHz	Base Clock 300MHz
Boost Clock -	Boost Clock 1.66GHz

Cache

L1 192KB/Xe-core	L1 -
L2 Cache 8MB shared	L2 Cache -

Memory

16GB GDDR6 placeholder	Shared Memory DDR5·DDR4
Memory Bus 256-bit	Memory Bus 128-bit
Memory Speed 17.5GT/s	Memory Speed 5.6GT/s
Memory Bandwidth 560GB/s	Memory Bandwidth 89.6GB/s

Power & Thermals

TDP 185W

TDP Shared

Video Output

Max Resolution 7680x4320	Max Resolution 7680x4320
Refresh Rate Calculator 7680x4320 Resolution8K UHD Refresh Rate 60Hz	Refresh Rate Calculator 7680x4320 Resolution8K UHD Refresh Rate 60Hz
Multi-Monitor 4	Multi-Monitor 4
Adaptive Sync FreeSync	Adaptive Sync -
DSC -	DSC Supported

API Support

Shader Model 6.6	Shader Model 6.6
DirectX DirectX 12 Direct3D 12_2	DirectX DirectX 12 Direct3D 12_1
OpenGL 4.6 OpenCL 3 Vulkan 1.3	OpenGL 4.6 OpenCL 3 Vulkan 1.2

Encoder

Encoder 2x Arc	Encoder Quick Sync Video 8
Codec JPEG VP9 AVC (H.264) HEVC (H.265) AV1	Codec JPEG VP9 AVC (H.264) HEVC (H.265) AV1

Decoder

Decoder 2x Arc	Decoder Quick Sync Video 8
Codec - MPEG-2 - JPEG - - VP9 AVC (H.264) HEVC (H.265) AV1	Codec MPEG-1 MPEG-2 MPEG-4 JPEG VC-1 VP8 VP9 AVC (H.264) HEVC (H.265) AV1

Card

Form Factor PCIe Card	Form Factor iGPU
PCIe PCIe 4.0 x16	PCIe -
Cooling Open-Air	Cooling Passive

Chip

Manufacturer Intel	Manufacturer Intel
Chip Designer Intel	Chip Designer Intel
Architecture Alchemist	Architecture Gen 12
Family Arc A	Family Gen 12
Branding	Branding
Codename Xe HPG	Codename Xe LP
Chip Variant DG2-512	Chip Variant -
Market Segment Embedded	Market Segment Desktop
Release Date Jul 1, 2024	Release Date Jan 1, 2025

Fabrication

Foundry TSMC	Foundry Intel
Fabrication Node N6	Fabrication Node Intel 7
Die Size 406mm²	Die Size 257mm²
Transistor Count 21.7B	Transistor Count 18.5B
Transistor Density 53.45 MTr/mm²	Transistor Density 72 MTr/mm²

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