Intel Arc A730M vs NVIDIA GeForce RTX 3050 Laptop 45W Full Specs
3,072 Shaders 1.1GHz | 2,048 Shaders 1.34GHz |
12GB GDDR6336GB/s | 4GB GDDR6192GB/s |
·· 6.76 TFLOPS | ·· 5.5 TFLOPS |
Form Factor Soldered | Form Factor Soldered |
TDP 80W | TDP 45W |
Clock Speed ··· | Clock Speed ··· |
Peak OPS 216.3 TOPSINT4 Tensor | Peak OPS 176 TOPSINT4 Tensor Sparse |
Tensor FP16-16 -FP16-16 Tensor Sparse -Tensor FP16-32 54.07 TFLOPSFP16-32 Tensor Sparse - | Tensor FP16-16 22 TFLOPSFP16-16 Tensor Sparse 44.01 TFLOPSTensor FP16-32 11 TFLOPSFP16-32 Tensor Sparse 22 TFLOPS |
BF16 -Tensor BF16 54.07 TFLOPSBF16 Tensor Sparse - | BF16 5.5 TFLOPSTensor BF16 11 TFLOPSBF16 Tensor Sparse 22 TFLOPS |
Tensor TF32 - | Tensor TF32 5.5 TFLOPS |
FP32 6.76 TFLOPS | FP32 5.5 TFLOPS |
FP64 1.69 TFLOPS | FP64 85.95 GFLOPS |
Tensor INT4 216.3 TOPS | Tensor INT4 88.01 TOPS |
Tensor INT8 108.1 TOPS | Tensor INT8 44.01 TOPS |
Ray - | Ray 8.3 TOPS |
Pixel Rate 105.6 GPixel/s | Pixel Rate 43 GPixel/s |
Texture Rate 211.2 GTexel/s | Texture Rate 86 GTexel/s |
Shaders 3,072 Shaders | Shaders 2,048 Shaders |
TMUs 192 TMUs | TMUs 64 TMUs |
ROPs 96 ROPs | ROPs 32 ROPs |
Tensor Cores 384 T-Cores | Tensor Cores 64 T-Cores |
RT Cores 24 RT-Cores | RT Cores 16 RT-Cores |
EUs 384 EUs | SMs 16 SMs |
Base Clock 300MHz | Base Clock 1.06GHz |
Boost Clock 1.1GHz | Boost Clock 1.34GHz |
L2 Cache 8MB shared | L2 Cache 2MB shared |
12GB GDDR6 | 4GB GDDR6 |
Memory Bus 192-bit | Memory Bus 128-bit |
Memory Speed 14GT/s | Memory Speed 12GT/s |
Memory Bandwidth 336GB/s | Memory Bandwidth 192GB/s |
ECC No | ECC No |
TDP 80W | TDP 45W |
Multi-Monitor 4 | Multi-Monitor 3 |
HDCP - | HDCP HDCP 2.3 |
Encoder Model Arc | Encoder Model NVENC 7 |
Codec AVC (H.264) HEVC (H.265) AV1 | Codec AVC (H.264) HEVC (H.265) - |
Decoder Model Arc | Decoder Model NVDEC 5 |
Codec - MPEG-2 - JPEG - - VP9 AVC (H.264) HEVC (H.265) AV1 | Codec MPEG-1 MPEG-2 MPEG-4 - VC-1 VP8 VP9 AVC (H.264) HEVC (H.265) AV1 |
Form Factor Soldered | Form Factor Soldered |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename Xe HPG | Codename NV177 |
Chip Variant DG2-512 | Chip Variant GA107-140-A1 |
Market Segment Laptop | Market Segment Laptop |
Release Date Jun 28, 2022 | Release Date May 11, 2021 |
Foundry TSMC | Foundry Samsung |
Fabrication Node N6 | Fabrication Node 8N |
Die Size 406mm² | Die Size 200mm² |
Transistor Count 21.7 Billion | Transistor Count 8.7 Billion |
Transistor Density 53.45 MTr/mm² | Transistor Density 43.5 MTr/mm² |

