Intel Arc A750 vs NVIDIA GeForce RTX 2070 Full Specs
3,584 Shaders 2.4GHz | 2,304 Shaders 1.62GHz |
8GB GDDR6512GB/s | 8GB GDDR6448GB/s |
·· 17.2 TFLOPS | ·· 7.46 TFLOPS |
Form Factor PCIe Card | Form Factor PCIe Card |
TDP 225W | TDP 175W |
Power Connectors - | Power Connectors 1x 8-Pin |
Clock Speed ··· | Clock Speed ··· |
Peak OPS 550.5 TOPSINT4 Tensor | Peak OPS 14.93 TFLOPSFP16 |
Tensor FP16-32 137.6 TFLOPS | - |
Tensor BF16 137.6 TFLOPS | - |
FP32 17.2 TFLOPS | FP32 7.46 TFLOPS |
FP64 4.3 TFLOPS | FP64 233.3 GFLOPS |
Tensor INT4 550.5 TOPS | Tensor INT4 - |
Tensor INT8 275.3 TOPS | - |
Pixel Rate 268.8 GPixel/s | Pixel Rate 103.7 GPixel/s |
Texture Rate 537.6 GTexel/s | Texture Rate 233.3 GTexel/s |
Shaders 3,584 Shaders | Shaders 2,304 Shaders |
TMUs 224 TMUs | TMUs 144 TMUs |
ROPs 112 ROPs | ROPs 64 ROPs |
Tensor Cores 448 T-Cores | Tensor Cores 288 T-Cores |
RT Cores 28 RT-Cores | RT Cores 36 RT-Cores |
EUs 448 EUs | SMs 36 SMs |
Base Clock 2.05GHz | Base Clock 1.41GHz |
Boost Clock 2.4GHz | Boost Clock 1.62GHz |
L2 Cache 8.2MB shared | L2 Cache 4.1MB shared |
8GB GDDR6 | 8GB GDDR6 |
Memory Bus 256-bit | Memory Bus 256-bit |
Memory Speed 16GT/s | Memory Speed 14GT/s |
Memory Bandwidth 512GB/s | Memory Bandwidth 448GB/s |
TDP 225W | TDP 175W |
Max Temp - | Max Temp 89°C Max |
Multi-Monitor 4 | Multi-Monitor 4 |
HDCP - | HDCP HDCP 2.2 |
3x DisplayPort 2.0 | - |
- | 3x DisplayPort 1.4 |
1x HDMI 2.1 | - |
- | 1x HDMI 2.0 |
- | 1x DVI-D Dual-Link |
- | 1x USB-C |
Encoder Model Arc | Encoder Model NVENC 7 |
Decoder Model Arc | Decoder Model NVDEC 4 |
Form Factor PCIe Card | Form Factor PCIe Card |
PCIe 2-Slots | PCIe 2-Slots |
Height 98.4 mm (3.87")Width 279.9 mm (11.02")Depth 40 mm (1.57") | Height 112.6 mm (4.43")Width 228.6 mm (9")Depth 35 mm (1.38") |
Cooling Open-Air 2x Fans | Cooling Open-Air 2x Fans |
Power Connectors - | Power Connectors 1x 8-Pin |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename Xe HPG | Codename NV166 |
Chip Variant DG2-512 | Chip Variant TU106-125-A1 |
Market Segment Desktop | Market Segment Desktop |
Release Date Oct 14, 2022 | Release Date Oct 17, 2018 |
Foundry TSMC | Foundry TSMC |
Fabrication Node N6 | Fabrication Node 12FFN |
Die Size 406mm² | Die Size 445mm² |
Transistor Count 21.7 Billion | Transistor Count 10.8 Billion |
Transistor Density 53.45 MTr/mm² | Transistor Density 24.27 MTr/mm² |
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