Intel Arc A750 vs NVIDIA GeForce RTX 3060 Ti GDDR6X Full Specs
3,584 Shaders 2.4GHz | 4,864 Shaders 1.67GHz |
8GB GDDR6512GB/s | 8GB GDDR6X608.3GB/s |
·· 17.2 TFLOPS | ·· 16.2 TFLOPS |
Form Factor PCIe Card | Form Factor PCIe Card |
TDP 225W | TDP 200W |
Power Connectors - | Power Connectors 1x 12-Pin |
Clock Speed ··· | Clock Speed ··· |
Peak OPS 550.5 TOPSINT4 Tensor | Peak OPS 518.3 TOPSINT4 Tensor Sparse |
Tensor FP16-16 -FP16-16 Tensor Sparse -Tensor FP16-32 137.6 TFLOPSFP16-32 Tensor Sparse - | Tensor FP16-16 64.79 TFLOPSFP16-16 Tensor Sparse 129.6 TFLOPSTensor FP16-32 32.39 TFLOPSFP16-32 Tensor Sparse 64.79 TFLOPS |
BF16 -Tensor BF16 137.6 TFLOPSBF16 Tensor Sparse - | BF16 16.2 TFLOPSTensor BF16 32.39 TFLOPSBF16 Tensor Sparse 64.79 TFLOPS |
Tensor TF32 - | Tensor TF32 16.2 TFLOPS |
FP32 17.2 TFLOPS | FP32 16.2 TFLOPS |
FP64 4.3 TFLOPS | FP64 253.1 GFLOPS |
Tensor INT4 550.5 TOPS | Tensor INT4 259.2 TOPS |
Tensor INT8 275.3 TOPS | Tensor INT8 129.6 TOPS |
Ray - | Ray 24.43 TOPS |
Pixel Rate 268.8 GPixel/s | Pixel Rate 133.2 GPixel/s |
Texture Rate 537.6 GTexel/s | Texture Rate 253.1 GTexel/s |
Shaders 3,584 Shaders | Shaders 4,864 Shaders |
TMUs 224 TMUs | TMUs 152 TMUs |
ROPs 112 ROPs | ROPs 80 ROPs |
Tensor Cores 448 T-Cores | Tensor Cores 152 T-Cores |
RT Cores 28 RT-Cores | RT Cores 38 RT-Cores |
EUs 448 EUs | SMs 38 SMs |
Base Clock 2.05GHz | Base Clock 1.41GHz |
Boost Clock 2.4GHz | Boost Clock 1.67GHz |
L2 Cache 8.2MB shared | L2 Cache 4.1MB shared |
8GB GDDR6 | 8GB GDDR6X |
Memory Bus 256-bit | Memory Bus 256-bit |
Memory Speed 16GT/s | Memory Speed 19GT/s |
Memory Bandwidth 512GB/s | Memory Bandwidth 608.3GB/s |
TDP 225W | TDP 200W |
Multi-Monitor 4 | Multi-Monitor 3 |
HDCP - | HDCP HDCP 2.3 |
3x DisplayPort 2.0 | - |
- | 3x DisplayPort 1.4 |
1x HDMI 2.1 | 1x HDMI 2.1 |
Encoder Model Arc | Encoder Model NVENC 7 |
Decoder Model Arc | Decoder Model NVDEC 5 |
Form Factor PCIe Card | Form Factor PCIe Card |
PCIe 2-Slots | PCIe - |
Height 98.4 mm (3.87")Width 279.9 mm (11.02")Depth 40 mm (1.57") | - |
Cooling Open-Air 2x Fans | Cooling Passive - |
Power Connectors - | Power Connectors 1x 12-Pin |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename Xe HPG | Codename NV174 |
Chip Variant DG2-512 | Chip Variant GA104-150-A1 |
Market Segment Desktop | Market Segment Desktop |
Release Date Oct 14, 2022 | Release Date Oct 27, 2022 |
Foundry TSMC | Foundry Samsung |
Fabrication Node N6 | Fabrication Node 8N |
Die Size 406mm² | Die Size 393mm² |
Transistor Count 21.7 Billion | Transistor Count 17.4 Billion |
Transistor Density 53.45 MTr/mm² | Transistor Density 44.33 MTr/mm² |
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