Intel Arc A750 vs NVIDIA Quadro P4000 Max-Q Full Specs

Summary

3,584 Shaders 2.4GHz	1,792 Shaders 1.23GHz
8GB GDDR6512GB/s	8GB GDDR5192GB/s
Peak·FP32·FP16 17.2 TFLOPS	Peak·FP32·FP16 4.4 TFLOPS
Form Factor PCIe Card	Form Factor Soldered
TDP 225W	TDP 80W

Highlights

Peak OPS

Peak OPS FP32 FP16 Tensor FP16-32 FP64 Tensor BF16 Tensor INT8 Tensor INT4 Memory Bandwidth TDP

Arc A750550.5 TOPSINT4 Tensor

x125.08

Quadro P4000 Max-Q4.4 TFLOPSFP32

x1

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Theoretical Performance

Clock Speed2400MHz UC·Base·Boost·OC	Clock Speed1228MHz UC·Base·Boost·OC
Peak OPS 550.5 TOPSINT4 Tensor	Peak OPS 4.4 TFLOPSFP32
Tensor FP16-32 137.6 TFLOPS	-
Tensor BF16 137.6 TFLOPS	-
FP32 17.2 TFLOPS	FP32 4.4 TFLOPS
FP64 4.3 TFLOPS	FP64 137.5 GFLOPS
Tensor INT4 550.5 TOPS	Tensor INT4 -
Tensor INT8 275.3 TOPS	-
Pixel Rate 268.8 GPixel/s	Pixel Rate 78.6 GPixel/s
Texture Rate 537.6 GTexel/s	Texture Rate 137.5 GTexel/s

Core Config

Shaders 3,584 Shaders	Shaders 1,792 Shaders
TMUs 224 TMUs	TMUs 112 TMUs
ROPs 112 ROPs	ROPs 64 ROPs
Tensor Cores 448 T-Cores	Tensor Cores -
RT Cores 28 RT-Cores	RT Cores -
EUs 448 EUs	SMs 14 SMs

Clocks

Base Clock 2.05GHz	Base Clock 1.11GHz
Boost Clock 2.4GHz	Boost Clock 1.23GHz

Cache

L2 Cache 8.2MB shared

L2 Cache 2MB shared

Memory

8GB GDDR6	8GB GDDR5
Memory Bus 256-bit	Memory Bus 256-bit
Memory Speed 16GT/s	Memory Speed 6GT/s
Memory Bandwidth 512GB/s	Memory Bandwidth 192GB/s
ECC No	ECC No

Power & Thermals

TDP 225W

TDP 80W

Video Output

Multi-Monitor 4

Multi-Monitor 3

Ports

3x DisplayPort 2.0	-
1x HDMI 2.1	-

Encoder

Encoder Model Arc

Encoder Model 2x NVENC 4

Decoder

Decoder Model Arc

Decoder Model NVDEC 3

Card

Form Factor PCIe Card	Form Factor Soldered
PCIe 2-Slots	PCIe -
Height 98.4 mm (3.87") Width 279.9 mm (11.02") Depth 40 mm (1.57")	-
Cooling Open-Air 2x Fans	Cooling Open-Air -

Chip

Manufacturer Intel	Manufacturer NVIDIA
Chip Designer Intel	Chip Designer NVIDIA
Architecture Alchemist	Architecture Pascal
Family Arc A	Family Quadro P
Branding	Branding
Codename Xe HPG	Codename NV134
Chip Variant DG2-512	Chip Variant GP104-140-A1
Market Segment Desktop	Market Segment Laptop
Release Date Oct 14, 2022	Release Date Jan 11, 2017

Fabrication

Foundry TSMC	Foundry TSMC
Fabrication Node N6	Fabrication Node 16FF
Die Size 406mm²	Die Size 314mm²
Transistor Count 21.7 Billion	Transistor Count 7.2 Billion
Transistor Density 53.45 MTr/mm²	Transistor Density 22.93 MTr/mm²

Images

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