Intel Arc A750 vs NVIDIA Quadro P5200 Laptop Full Specs

Summary

3,584 Shaders 2.4GHz	2,560 Shaders 1.76GHz
8GB GDDR6512GB/s	16GB GDDR5160.4GB/s
Peak·FP32·FP16 17.2 TFLOPS	Peak·FP32·FP16 9.01 TFLOPS
Form Factor PCIe Card	Form Factor Soldered
TDP 225W	TDP 150W

Theoretical Performance

Clock Speed2400MHz UC·Base·Boost·OC	Clock Speed1759MHz UC·Base·Boost·OC
Peak OPS 550.5 TOPSINT4 Tensor	Peak OPS 9.01 TFLOPSFP32
Tensor FP16-32 137.6 TFLOPS	-
Tensor BF16 137.6 TFLOPS	-
FP32 17.2 TFLOPS	FP32 9.01 TFLOPS
FP64 4.3 TFLOPS	FP64 281.4 GFLOPS
Tensor INT4 550.5 TOPS	Tensor INT4 -
Tensor INT8 275.3 TOPS	-
Pixel Rate 268.8 GPixel/s	Pixel Rate 112.6 GPixel/s
Texture Rate 537.6 GTexel/s	Texture Rate 281.4 GTexel/s

Core Config

Shaders 3,584 Shaders	Shaders 2,560 Shaders
TMUs 224 TMUs	TMUs 160 TMUs
ROPs 112 ROPs	ROPs 64 ROPs
Tensor Cores 448 T-Cores	Tensor Cores -
RT Cores 28 RT-Cores	RT Cores -
EUs 448 EUs	SMs 20 SMs

Clocks

Base Clock 2.05GHz	Base Clock 1.58GHz
Boost Clock 2.4GHz	Boost Clock 1.76GHz

Cache

L2 Cache 8MB shared

L2 Cache 2MB shared

Memory

8GB GDDR6	16GB GDDR5
Memory Bus 256-bit	Memory Bus 256-bit
Memory Speed 16GT/s	Memory Speed 5GT/s
Memory Bandwidth 512GB/s	Memory Bandwidth 160.4GB/s
ECC No	ECC No

Power & Thermals

TDP 225W

TDP 150W

Video Output

Multi-Monitor 4

Multi-Monitor 3

Ports

3x DisplayPort 2.0 1x HDMI 2.1

-

Encoder

Encoder Model Arc	Encoder Model 2x NVENC 4
Codec AVC (H.264) HEVC (H.265) AV1	Codec AVC (H.264) HEVC (H.265) -

Decoder

Decoder Model Arc	Decoder Model NVDEC 3
Codec - MPEG-2 - JPEG - VP9 AVC (H.264) HEVC (H.265) AV1	Codec MPEG-1 MPEG-2 MPEG-4 - VC-1 VP9 AVC (H.264) HEVC (H.265) -

Card

Form Factor PCIe Card	Form Factor Soldered
PCIe 2-Slots	PCIe -
Height 98.4 mm (3.87") Width 279.9 mm (11.02") Depth 40 mm (1.57")	-
Cooling Open-Air 2x Fans	Cooling Open-Air -

Chip

Manufacturer Intel	Manufacturer NVIDIA
Chip Designer Intel	Chip Designer NVIDIA
Architecture Alchemist	Architecture Pascal
Family Arc A	Family Quadro P
Branding	Branding
Codename Xe HPG	Codename NV134
Chip Variant DG2-512	Chip Variant GP104-140-A1
Market Segment Desktop	Market Segment Laptop
Release Date Oct 14, 2022	Release Date Feb 21, 2018

Fabrication

Foundry TSMC	Foundry TSMC
Fabrication Node N6	Fabrication Node 16FF
Die Size 406mm²	Die Size 314mm²
Transistor Count 21.7 Billion	Transistor Count 7.2 Billion
Transistor Density 53.45 MTr/mm²	Transistor Density 22.93 MTr/mm²

Images