Intel Arc A770 16GB vs Intel Arc A770M Full Specs

Summary

4,096 Shaders 2.4GHz	4,096 Shaders 1.65GHz
16GB GDDR6560.1GB/s	16GB GDDR6512GB/s
Peak·FP32·FP16 19.66 TFLOPS	Peak·FP32·FP16 13.52 TFLOPS
Form Factor PCIe Card	Form Factor Soldered
TDP 225W	TDP 120W

Theoretical Performance

Clock Speed2400MHz UC·Base·Boost·OC	Clock Speed1650MHz UC·Base·Boost·OC
Peak OPS 629.1 TOPSINT4 Tensor	Peak OPS 432.5 TOPSINT4 Tensor
Tensor FP16-32 157.3 TFLOPS	Tensor FP16-32 108.1 TFLOPS
Tensor BF16 157.3 TFLOPS	Tensor BF16 108.1 TFLOPS
FP32 19.66 TFLOPS	FP32 13.52 TFLOPS
FP64 4.92 TFLOPS	FP64 3.38 TFLOPS
Tensor INT4 629.1 TOPS	Tensor INT4 432.5 TOPS
Tensor INT8 314.6 TOPS	Tensor INT8 216.3 TOPS
Pixel Rate 307.2 GPixel/s	Pixel Rate 211.2 GPixel/s
Texture Rate 614.4 GTexel/s	Texture Rate 422.4 GTexel/s

Core Config

Shaders 4,096 Shaders	Shaders 4,096 Shaders
TMUs 256 TMUs	TMUs 256 TMUs
ROPs 128 ROPs	ROPs 128 ROPs
Tensor Cores 512 T-Cores	Tensor Cores 512 T-Cores
RT Cores 32 RT-Cores	RT Cores 32 RT-Cores
EUs 512 EUs	EUs 512 EUs

Clocks

Base Clock 2.1GHz	Base Clock 300MHz
Boost Clock 2.4GHz	Boost Clock 1.65GHz

Cache

L2 Cache 8MB shared

L2 Cache 8MB shared

Memory

16GB GDDR6	16GB GDDR6
Memory Bus 256-bit	Memory Bus 256-bit
Memory Speed 17.5GT/s	Memory Speed 16GT/s
Memory Bandwidth 560.1GB/s	Memory Bandwidth 512GB/s
ECC No	ECC No

Power & Thermals

TDP 225W

TDP 120W

Video Output

Multi-Monitor 4

Multi-Monitor 4

Ports

3x DisplayPort 2.0 1x HDMI 2.1

-

Encoder

Encoder Model Arc	Encoder Model Arc
Codec AVC (H.264) HEVC (H.265) AV1	Codec AVC (H.264) HEVC (H.265) AV1

Decoder

Decoder Model Arc	Decoder Model Arc
Codec MPEG-2 JPEG VP9 AVC (H.264) HEVC (H.265) AV1	Codec MPEG-2 JPEG VP9 AVC (H.264) HEVC (H.265) AV1

Card

Form Factor PCIe Card	Form Factor Soldered
PCIe 2-Slots	PCIe -
Height 98.4 mm (3.87") Width 279.9 mm (11.02") Depth 40 mm (1.57")	-
Cooling Open-Air 2x Fans	Cooling Open-Air -

Chip

Manufacturer Intel	Manufacturer Intel
Chip Designer Intel	Chip Designer Intel
Architecture Alchemist	Architecture Alchemist
Family Arc A	Family Arc A
Branding	Branding
Codename Xe HPG	Codename Xe HPG
Chip Variant DG2-512	Chip Variant DG2-512
Market Segment Desktop	Market Segment Laptop
Release Date Oct 14, 2022	Release Date Jun 28, 2022

Fabrication

Foundry TSMC	Foundry TSMC
Fabrication Node N6	Fabrication Node N6
Die Size 406mm²	Die Size 406mm²
Transistor Count 21.7 Billion	Transistor Count 21.7 Billion
Transistor Density 53.45 MTr/mm²	Transistor Density 53.45 MTr/mm²

Images