Intel Arc A770 16GB vs NVIDIA GeForce RTX 2060 Laptop Full Specs

Summary

4,096 Shaders 2.4GHz	1,920 Shaders 1.2GHz
16GB GDDR6560.1GB/s	6GB GDDR6336GB/s
Peak·FP32·FP16 19.66 TFLOPS	Peak·FP32·FP16 4.61 TFLOPS
Form Factor PCIe Card	Form Factor Soldered
TDP 225W	TDP 80W

Theoretical Performance

Clock Speed2400MHz UC·Base·Boost·OC	Clock Speed1200MHz UC·Base·Boost·OC
Peak OPS 629.1 TOPSINT4 Tensor	Peak OPS 9.22 TFLOPSFP16
Tensor FP16-32 157.3 TFLOPS	-
Tensor BF16 157.3 TFLOPS	-
FP32 19.66 TFLOPS	FP32 4.61 TFLOPS
FP64 4.92 TFLOPS	FP64 144 GFLOPS
Tensor INT4 629.1 TOPS	Tensor INT4 -
Tensor INT8 314.6 TOPS	-
Pixel Rate 307.2 GPixel/s	Pixel Rate 57.6 GPixel/s
Texture Rate 614.4 GTexel/s	Texture Rate 144 GTexel/s

Core Config

Shaders 4,096 Shaders	Shaders 1,920 Shaders
TMUs 256 TMUs	TMUs 120 TMUs
ROPs 128 ROPs	ROPs 48 ROPs
Tensor Cores 512 T-Cores	Tensor Cores 240 T-Cores
RT Cores 32 RT-Cores	RT Cores 30 RT-Cores
EUs 512 EUs	SMs 30 SMs

Clocks

Base Clock 2.1GHz	Base Clock 960MHz
Boost Clock 2.4GHz	Boost Clock 1.2GHz

Cache

L2 Cache 8MB shared

L2 Cache 3MB shared

Memory

16GB GDDR6	6GB GDDR6
Memory Bus 256-bit	Memory Bus 192-bit
Memory Speed 17.5GT/s	Memory Speed 14GT/s
Memory Bandwidth 560.1GB/s	Memory Bandwidth 336GB/s
ECC No	ECC No

Power & Thermals

TDP 225W

TDP 80W

Video Output

Multi-Monitor 4	Multi-Monitor 3
HDCP -	HDCP HDCP 2.2

Ports

3x DisplayPort 2.0 1x HDMI 2.1

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Encoder

Encoder Model Arc	Encoder Model NVENC 7
Codec AVC (H.264) HEVC (H.265) AV1	Codec AVC (H.264) HEVC (H.265) -

Decoder

Decoder Model Arc	Decoder Model NVDEC 4
Codec - MPEG-2 - JPEG - - VP9 AVC (H.264) HEVC (H.265) AV1	Codec MPEG-1 MPEG-2 MPEG-4 - VC-1 VP8 VP9 AVC (H.264) HEVC (H.265) -

Card

Form Factor PCIe Card	Form Factor Soldered
PCIe 2-Slots	PCIe -
Height 98.4 mm (3.87") Width 279.9 mm (11.02") Depth 40 mm (1.57")	-
Cooling Open-Air 2x Fans	Cooling Open-Air -

Chip

Manufacturer Intel	Manufacturer NVIDIA
Chip Designer Intel	Chip Designer NVIDIA
Architecture Alchemist	Architecture Turing
Family Arc A	Family GeForce 20
Branding	Branding
Codename Xe HPG	Codename NV166
Chip Variant DG2-512	Chip Variant TU106-125-A1
Market Segment Desktop	Market Segment Laptop
Release Date Oct 14, 2022	Release Date Jan 29, 2019

Fabrication

Foundry TSMC	Foundry TSMC
Fabrication Node N6	Fabrication Node 12FFN
Die Size 406mm²	Die Size 445mm²
Transistor Count 21.7 Billion	Transistor Count 10.8 Billion
Transistor Density 53.45 MTr/mm²	Transistor Density 24.27 MTr/mm²

Images