Intel Arc A770 16GB vs NVIDIA GeForce RTX 2070 Super Laptop Full Specs
4,096 Shaders 2.4GHz | 2,560 Shaders 1.38GHz |
16GB GDDR6560.1GB/s | 8GB GDDR6448GB/s |
·· 19.66 TFLOPS | ·· 7.07 TFLOPS |
Form Factor PCIe Card | Form Factor Soldered |
TDP 225W | TDP 115W |
Arc A770 16GB629.1 TOPSINT4 Tensor
GeForce RTX 2070 Super Laptop226.1 TOPSINT4 TensorClock Speed ··· | Clock Speed ··· |
Peak OPS 629.1 TOPSINT4 Tensor | Peak OPS 226.1 TOPSINT4 Tensor |
Tensor FP16-16 -Tensor FP16-32 157.3 TFLOPS | Tensor FP16-16 56.52 TFLOPSTensor FP16-32 28.26 TFLOPS |
Tensor BF16 157.3 TFLOPS | Tensor BF16 28.26 TFLOPS |
Tensor TF32 - | Tensor TF32 28.26 TFLOPS |
FP32 19.66 TFLOPS | FP32 7.07 TFLOPS |
FP64 4.92 TFLOPS | FP64 220.8 GFLOPS |
Tensor INT4 629.1 TOPS | Tensor INT4 226.1 TOPS |
Tensor INT8 314.6 TOPS | Tensor INT8 113 TOPS |
Ray - | Ray 21.31 TOPS |
Pixel Rate 307.2 GPixel/s | Pixel Rate 88.3 GPixel/s |
Texture Rate 614.4 GTexel/s | Texture Rate 220.8 GTexel/s |
Shaders 4,096 Shaders | Shaders 2,560 Shaders |
TMUs 256 TMUs | TMUs 160 TMUs |
ROPs 128 ROPs | ROPs 64 ROPs |
Tensor Cores 512 T-Cores | Tensor Cores 320 T-Cores |
RT Cores 32 RT-Cores | RT Cores 40 RT-Cores |
EUs 512 EUs | SMs 40 SMs |
Base Clock 2.1GHz | Base Clock 1.14GHz |
Boost Clock 2.4GHz | Boost Clock 1.38GHz |
L2 Cache 8.2MB shared | L2 Cache 4.1MB shared |
16GB GDDR6 | 8GB GDDR6 |
Memory Bus 256-bit | Memory Bus 256-bit |
Memory Speed 17.5GT/s | Memory Speed 14GT/s |
Memory Bandwidth 560.1GB/s | Memory Bandwidth 448GB/s |
TDP 225W | TDP 115W |
Multi-Monitor 4 | Multi-Monitor 3 |
HDCP - | HDCP HDCP 2.2 |
3x DisplayPort 2.0 | - |
1x HDMI 2.1 | - |
Encoder Model Arc | Encoder Model NVENC 7 |
Decoder Model Arc | Decoder Model NVDEC 4 |
Form Factor PCIe Card | Form Factor Soldered |
PCIe 2-Slots | PCIe - |
Height 98.4 mm (3.87")Width 279.9 mm (11.02")Depth 40 mm (1.57") | - |
Cooling Open-Air 2x Fans | Cooling Open-Air - |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding  | Branding  |
Codename Xe HPG | Codename NV164 |
Chip Variant DG2-512 | Chip Variant TU104-150-KC-A1 |
Market Segment Desktop | Market Segment Laptop |
Release Date Oct 14, 2022 | Release Date Apr 2, 2020 |
Foundry TSMC | Foundry TSMC |
Fabrication Node N6 | Fabrication Node 12FFN |
Die Size 406mm² | Die Size 545mm² |
Transistor Count 21.7 Billion | Transistor Count 13.6 Billion |
Transistor Density 53.45 MTr/mm² | Transistor Density 24.95 MTr/mm² |
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