GPUs

Intel Arc A770 16GB vs NVIDIA GeForce RTX 3060 Laptop 65W Full Specs

4,096 Shaders
2.4GHz
3,840 Shaders
1.36GHz
16GB GDDR6560.1GB/s
6GB GDDR6288GB/s
··
19.66 TFLOPS
··
10.42 TFLOPS
Form Factor
PCIe Card
Form Factor
Soldered
TDP
225W
TDP
65W

Clock Speed
···
Clock Speed
···
Peak OPS
629.1 TOPSINT4 Tensor
Peak OPS
333.5 TOPSINT4 Tensor Sparse
Tensor FP16-16
-
FP16-16 Tensor Sparse
-
Tensor FP16-32
157.3 TFLOPS
FP16-32 Tensor Sparse
-
Tensor FP16-16
41.69 TFLOPS
FP16-16 Tensor Sparse
83.37 TFLOPS
Tensor FP16-32
20.84 TFLOPS
FP16-32 Tensor Sparse
41.69 TFLOPS
BF16
-
Tensor BF16
157.3 TFLOPS
BF16 Tensor Sparse
-
BF16
10.42 TFLOPS
Tensor BF16
20.84 TFLOPS
BF16 Tensor Sparse
41.69 TFLOPS
Tensor TF32
-
Tensor TF32
10.42 TFLOPS
FP32
19.66 TFLOPS
FP32
10.42 TFLOPS
FP64
4.92 TFLOPS
FP64
162.8 GFLOPS
Tensor INT4
629.1 TOPS
Tensor INT4
166.7 TOPS
Tensor INT8
314.6 TOPS
Tensor INT8
83.37 TOPS
Ray
-
Ray
15.72 TOPS
Pixel Rate
307.2 GPixel/s
Pixel Rate
65.1 GPixel/s
Texture Rate
614.4 GTexel/s
Texture Rate
162.8 GTexel/s

Shaders
4,096 Shaders
Shaders
3,840 Shaders
TMUs
256 TMUs
TMUs
120 TMUs
ROPs
128 ROPs
ROPs
48 ROPs
Tensor Cores
512 T-Cores
Tensor Cores
120 T-Cores
RT Cores
32 RT-Cores
RT Cores
30 RT-Cores
EUs
512 EUs
SMs
30 SMs

Base Clock
2.1GHz
Base Clock
975MHz
Boost Clock
2.4GHz
Boost Clock
1.36GHz

L2 Cache
8MB shared
L2 Cache
3MB shared

16GB GDDR6
6GB GDDR6
Memory Bus
256-bit
Memory Bus
192-bit
Memory Speed
17.5GT/s
Memory Speed
12GT/s
Memory Bandwidth
560.1GB/s
Memory Bandwidth
288GB/s
ECC
No
ECC
No

TDP
225W
TDP
65W

Multi-Monitor
4
Multi-Monitor
3
HDCP
-
HDCP
HDCP 2.3

3x DisplayPort 2.0
1x HDMI 2.1
-

Encoder Model
Arc
Encoder Model
NVENC 7
Codec
AVC (H.264)
HEVC (H.265)
AV1
Codec
AVC (H.264)
HEVC (H.265)
-

Decoder Model
Arc
Decoder Model
NVDEC 5
Codec
-
MPEG-2
-
JPEG
-
-
VP9
AVC (H.264)
HEVC (H.265)
AV1
Codec
MPEG-1
MPEG-2
MPEG-4
-
VC-1
VP8
VP9
AVC (H.264)
HEVC (H.265)
AV1

Form Factor
PCIe Card
Form Factor
Soldered
PCIe
2-Slots
PCIe
-
Height
98.4 mm (3.87")
Width
279.9 mm (11.02")
Depth
40 mm (1.57")
-
Cooling
Open-Air
2x Fans
Cooling
Open-Air
-

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
Arc branding
Branding
GeForce RTX 2018 branding
Codename
Xe HPG
Codename
NV176
Chip Variant
DG2-512
Chip Variant
GA106-150-KA-A1
Market Segment
Desktop
Market Segment
Laptop
Release Date
Oct 14, 2022
Release Date
Feb 25, 2021

Foundry
TSMC
Foundry
Samsung
Fabrication Node
N6
Fabrication Node
8N
Die Size
406mm²
Die Size
276mm²
Transistor Count
21.7 Billion
Transistor Count
13.3 Billion
Transistor Density
53.45 MTr/mm²
Transistor Density
48.01 MTr/mm²