Intel Arc A770 16GB vs NVIDIA Quadro P2000 Laptop Full Specs

Summary

4,096 Shaders 2.4GHz	768 Shaders 1.61GHz
16GB GDDR6560.1GB/s	5GB GDDR596GB/s
Peak·FP32·FP16 19.66 TFLOPS	Peak·FP32·FP16 2.47 TFLOPS
Form Factor PCIe Card	Form Factor Soldered
TDP 225W	TDP 50W

Highlights

Peak OPS

Peak OPS FP32 FP16 Tensor FP16-32 FP64 Tensor BF16 Tensor INT8 Tensor INT4 Memory Bandwidth TDP

Arc A770 16GB629.1 TOPSINT4 Tensor

x254.88

Quadro P2000 Laptop2.47 TFLOPSFP32

x1

Show Top Score

Theoretical Performance

Clock Speed2400MHz UC·Base·Boost·OC	Clock Speed1607MHz UC·Base·Boost·OC
Peak OPS 629.1 TOPSINT4 Tensor	Peak OPS 2.47 TFLOPSFP32
Tensor FP16-32 157.3 TFLOPS	-
Tensor BF16 157.3 TFLOPS	-
FP32 19.66 TFLOPS	FP32 2.47 TFLOPS
FP64 4.92 TFLOPS	FP64 77.14 GFLOPS
Tensor INT4 629.1 TOPS	Tensor INT4 -
Tensor INT8 314.6 TOPS	-
Pixel Rate 307.2 GPixel/s	Pixel Rate 51.4 GPixel/s
Texture Rate 614.4 GTexel/s	Texture Rate 102.9 GTexel/s

Core Config

Shaders 4,096 Shaders	Shaders 768 Shaders
TMUs 256 TMUs	TMUs 64 TMUs
ROPs 128 ROPs	ROPs 32 ROPs
Tensor Cores 512 T-Cores	Tensor Cores -
RT Cores 32 RT-Cores	RT Cores -
EUs 512 EUs	SMs 6 SMs

Clocks

Base Clock 2.1GHz	Base Clock 1.56GHz
Boost Clock 2.4GHz	Boost Clock 1.61GHz

Cache

L2 Cache 8.2MB shared

L2 Cache 1MB shared

Memory

16GB GDDR6	5GB GDDR5
Memory Bus 256-bit	Memory Bus 128-bit
Memory Speed 17.5GT/s	Memory Speed 6GT/s
Memory Bandwidth 560.1GB/s	Memory Bandwidth 96GB/s
ECC No	ECC No

Power & Thermals

TDP 225W

TDP 50W

Video Output

Multi-Monitor 4

Multi-Monitor 3

Ports

3x DisplayPort 2.0	-
1x HDMI 2.1	-

Encoder

Encoder Model Arc

Encoder Model NVENC 4

Decoder

Decoder Model Arc

Decoder Model NVDEC 3

Card

Form Factor PCIe Card	Form Factor Soldered
PCIe 2-Slots	PCIe -
Height 98.4 mm (3.87") Width 279.9 mm (11.02") Depth 40 mm (1.57")	-
Cooling Open-Air 2x Fans	Cooling Open-Air -

Chip

Manufacturer Intel	Manufacturer NVIDIA
Chip Designer Intel	Chip Designer NVIDIA
Architecture Alchemist	Architecture Pascal
Family Arc A	Family Quadro P
Branding	Branding
Codename Xe HPG	Codename NV137
Chip Variant DG2-512	Chip Variant GP107-300-A1
Market Segment Desktop	Market Segment Laptop
Release Date Oct 14, 2022	Release Date Feb 6, 2017

Fabrication

Foundry TSMC	Foundry Samsung
Fabrication Node N6	Fabrication Node 14LPP
Die Size 406mm²	Die Size 132mm²
Transistor Count 21.7 Billion	Transistor Count 3.3 Billion
Transistor Density 53.45 MTr/mm²	Transistor Density 25 MTr/mm²

Images

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Competitors

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