Intel Arc A770 16GB vs NVIDIA Quadro P3000 Laptop Full Specs

Summary

4,096 Shaders 2.4GHz	1,280 Shaders 1.22GHz
16GB GDDR6560.1GB/s	6GB GDDR5168GB/s
Peak·FP32·FP16 19.66 TFLOPS	Peak·FP32·FP16 3.11 TFLOPS
Form Factor PCIe Card	Form Factor Soldered
TDP 225W	TDP 75W

Highlights

Peak OPS

Peak OPS FP32 FP16 Tensor FP16-32 FP64 Tensor BF16 Tensor INT8 Tensor INT4 Memory Bandwidth TDP

Arc A770 16GB629.1 TOPSINT4 Tensor

x202.27

Quadro P3000 Laptop3.11 TFLOPSFP32

x1

Show Top Score

Theoretical Performance

Clock Speed2400MHz UC·Base·Boost·OC	Clock Speed1215MHz UC·Base·Boost·OC
Peak OPS 629.1 TOPSINT4 Tensor	Peak OPS 3.11 TFLOPSFP32
Tensor FP16-32 157.3 TFLOPS	-
Tensor BF16 157.3 TFLOPS	-
FP32 19.66 TFLOPS	FP32 3.11 TFLOPS
FP64 4.92 TFLOPS	FP64 97.2 GFLOPS
Tensor INT4 629.1 TOPS	Tensor INT4 -
Tensor INT8 314.6 TOPS	-
Pixel Rate 307.2 GPixel/s	Pixel Rate 58.3 GPixel/s
Texture Rate 614.4 GTexel/s	Texture Rate 97.2 GTexel/s

Core Config

Shaders 4,096 Shaders	Shaders 1,280 Shaders
TMUs 256 TMUs	TMUs 80 TMUs
ROPs 128 ROPs	ROPs 48 ROPs
Tensor Cores 512 T-Cores	Tensor Cores -
RT Cores 32 RT-Cores	RT Cores -
EUs 512 EUs	SMs 10 SMs

Clocks

Base Clock 2.1GHz	Base Clock 1.09GHz
Boost Clock 2.4GHz	Boost Clock 1.22GHz

Cache

L2 Cache 8.2MB shared

L2 Cache 1.5MB shared

Memory

16GB GDDR6	6GB GDDR5
Memory Bus 256-bit	Memory Bus 192-bit
Memory Speed 17.5GT/s	Memory Speed 7GT/s
Memory Bandwidth 560.1GB/s	Memory Bandwidth 168GB/s
ECC No	ECC No

Power & Thermals

TDP 225W

TDP 75W

Video Output

Multi-Monitor 4

Multi-Monitor 3

Ports

3x DisplayPort 2.0	-
1x HDMI 2.1	-

Encoder

Encoder Model Arc

Encoder Model NVENC 4

Decoder

Decoder Model Arc

Decoder Model NVDEC 3

Card

Form Factor PCIe Card	Form Factor Soldered
PCIe 2-Slots	PCIe -
Height 98.4 mm (3.87") Width 279.9 mm (11.02") Depth 40 mm (1.57")	-
Cooling Open-Air 2x Fans	Cooling Open-Air -

Chip

Manufacturer Intel	Manufacturer NVIDIA
Chip Designer Intel	Chip Designer NVIDIA
Architecture Alchemist	Architecture Pascal
Family Arc A	Family Quadro P
Branding	Branding
Codename Xe HPG	Codename NV136
Chip Variant DG2-512	Chip Variant GP106-300-A1
Market Segment Desktop	Market Segment Laptop
Release Date Oct 14, 2022	Release Date Jan 11, 2017

Fabrication

Foundry TSMC	Foundry TSMC
Fabrication Node N6	Fabrication Node 16FF
Die Size 406mm²	Die Size 200mm²
Transistor Count 21.7 Billion	Transistor Count 4.4 Billion
Transistor Density 53.45 MTr/mm²	Transistor Density 22 MTr/mm²

Images

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