Intel Arc A770 vs Intel Max 1550 Full Specs
4,096 Shaders 2.4GHz | 16,384 Shaders 1.6GHz |
8GB GDDR6512GB/s | 128GB HBM2e3.28TB/s |
·· 19.66 TFLOPS | ·· 52.43 TFLOPS |
Form Factor PCIe Card | Form Factor OAM Module |
TDP 225W | TDP 600W |
Clock Speed ··· | Clock Speed ··· |
Peak OPS 629.1 TOPSINT4 Tensor | Peak OPS 1.68 POPSINT8 Tensor |
Tensor FP16-32 157.3 TFLOPS | Tensor FP16-32 838.9 TFLOPS |
Tensor BF16 157.3 TFLOPS | Tensor BF16 838.9 TFLOPS |
Tensor TF32 - | Tensor TF32 419.4 TFLOPS |
FP32 19.66 TFLOPS | FP32 52.43 TFLOPS |
FP64 4.92 TFLOPS | FP64 52.43 TFLOPS |
Tensor INT4 629.1 TOPS | Tensor INT4 - |
Tensor INT8 314.6 TOPS | Tensor INT8 1.68 POPS |
Pixel Rate 307.2 GPixel/s | Pixel Rate - |
Texture Rate 614.4 GTexel/s | Texture Rate - |
Shaders 4,096 Shaders | Shaders 16,384 Shaders |
TMUs 256 TMUs | TMUs - |
ROPs 128 ROPs | ROPs - |
Tensor Cores 512 T-Cores | Tensor Cores 1,024 T-Cores |
RT Cores 32 RT-Cores | RT Cores 128 RT-Cores |
EUs 512 EUs | EUs 1,024 EUs |
Base Clock 2.1GHz | Base Clock 900MHz |
Boost Clock 2.4GHz | Boost Clock 1.6GHz |
L1 192KB/Xe-core | L1 512KB/Xe-core |
L2 Cache 8MB shared | L2 Cache 408MB shared |
8GB GDDR6 | 128GB HBM2e |
Memory Bus 256-bit | Memory Bus 8192-bit |
Memory Speed 16GT/s | Memory Speed 3.2GT/s |
Memory Bandwidth 512GB/s | Memory Bandwidth 3.28TB/s |
ECC No | ECC - |
TDP 225W | TDP 600W |
Max Resolution 7680x4320 | Max Resolution - |
Refresh Rate Calculator 7680x4320 Resolution8K UHD Refresh Rate 60Hz | Refresh Rate Calculator - |
Multi-Monitor 4 | Multi-Monitor - |
Adaptive Sync FreeSync | Adaptive Sync - |
3x DisplayPort 2.0 1x HDMI 2.1 | - |
Shader Model 6.6 | Shader Model - |
DirectX DirectX 12Direct3D 12_2 | - |
OpenGL 4.6OpenCL 3Vulkan 1.3 | - |
Encoder Arc | - |
Codec JPEG VP9 AVC (H.264) HEVC (H.265) AV1 | Codec - |
Decoder Arc | - |
Codec MPEG-2 JPEG VP9 AVC (H.264) HEVC (H.265) AV1 | Codec - |
Form Factor PCIe Card | Form Factor OAM Module |
PCIe PCIe 4.0 x16 2-Slots | PCIe - |
Height 98.4mm (3.87")Width 279.9mm (11.02")Depth 40mm (1.57") | - |
Cooling Open-Air 2x Fans | Cooling Open-Air - |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename Xe HPG | Codename Ponte Vecchio |
Chip Variant DG2-512 | Chip Variant - |
Market Segment Desktop | Market Segment Server |
Release Date Oct 14, 2022 | Release Date Jan 1, 2023 |
Foundry TSMC | Foundry TSMC |
Other Foundries - | Other Foundries IntelActive Interposer IntelCache TSMCIO |
Fabrication Node N6 - - - | Fabrication Node N5 Intel 7Active Interposer Intel 7Cache N7IO |
Die Size 406mm² - - - | Die Size 645mm² 1292mm²Active Interposer 114mm²Cache 148mm²IO |
Transistor Count 21.7B | Transistor Count - |
Transistor Density 53.45 MTr/mm² | Transistor Density - |





