Intel Arc A770 vs NVIDIA GeForce RTX 3060 Laptop 60W Full Specs
4,096 Shaders 2.4GHz | 3,840 Shaders 1.28GHz |
8GB GDDR6512GB/s | 6GB GDDR6288GB/s |
·· 19.66 TFLOPS | ·· 9.85 TFLOPS |
Form Factor PCIe Card | Form Factor Soldered |
TDP 225W | TDP 60W |
Clock Speed ··· | Clock Speed ··· |
Peak OPS 629.1 TOPSINT4 Tensor | Peak OPS 315.1 TOPSINT4 Tensor Sparse |
Tensor FP16-16 -FP16-16 Tensor Sparse -Tensor FP16-32 157.3 TFLOPSFP16-32 Tensor Sparse - | Tensor FP16-16 39.38 TFLOPSFP16-16 Tensor Sparse 78.77 TFLOPSTensor FP16-32 19.69 TFLOPSFP16-32 Tensor Sparse 39.38 TFLOPS |
BF16 -Tensor BF16 157.3 TFLOPSBF16 Tensor Sparse - | BF16 9.85 TFLOPSTensor BF16 19.69 TFLOPSBF16 Tensor Sparse 39.38 TFLOPS |
Tensor TF32 - | Tensor TF32 9.85 TFLOPS |
FP32 19.66 TFLOPS | FP32 9.85 TFLOPS |
FP64 4.92 TFLOPS | FP64 153.8 GFLOPS |
Tensor INT4 629.1 TOPS | Tensor INT4 157.5 TOPS |
Tensor INT8 314.6 TOPS | Tensor INT8 78.77 TOPS |
Ray - | Ray 14.85 TOPS |
Pixel Rate 307.2 GPixel/s | Pixel Rate 61.5 GPixel/s |
Texture Rate 614.4 GTexel/s | Texture Rate 153.8 GTexel/s |
Shaders 4,096 Shaders | Shaders 3,840 Shaders |
TMUs 256 TMUs | TMUs 120 TMUs |
ROPs 128 ROPs | ROPs 48 ROPs |
Tensor Cores 512 T-Cores | Tensor Cores 120 T-Cores |
RT Cores 32 RT-Cores | RT Cores 30 RT-Cores |
EUs 512 EUs | SMs 30 SMs |
Base Clock 2.1GHz | Base Clock 817MHz |
Boost Clock 2.4GHz | Boost Clock 1.28GHz |
L2 Cache 8MB shared | L2 Cache 3MB shared |
8GB GDDR6 | 6GB GDDR6 |
Memory Bus 256-bit | Memory Bus 192-bit |
Memory Speed 16GT/s | Memory Speed 12GT/s |
Memory Bandwidth 512GB/s | Memory Bandwidth 288GB/s |
ECC No | ECC No |
TDP 225W | TDP 60W |
Multi-Monitor 4 | Multi-Monitor 3 |
HDCP - | HDCP HDCP 2.3 |
3x DisplayPort 2.0 1x HDMI 2.1 | - |
Encoder Model Arc | Encoder Model NVENC 7 |
Codec AVC (H.264) HEVC (H.265) AV1 | Codec AVC (H.264) HEVC (H.265) - |
Decoder Model Arc | Decoder Model NVDEC 5 |
Codec - MPEG-2 - JPEG - - VP9 AVC (H.264) HEVC (H.265) AV1 | Codec MPEG-1 MPEG-2 MPEG-4 - VC-1 VP8 VP9 AVC (H.264) HEVC (H.265) AV1 |
Form Factor PCIe Card | Form Factor Soldered |
PCIe 2-Slots | PCIe - |
Height 98.4 mm (3.87")Width 279.9 mm (11.02")Depth 40 mm (1.57") | - |
Cooling Open-Air 2x Fans | Cooling Open-Air - |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename Xe HPG | Codename NV176 |
Chip Variant DG2-512 | Chip Variant GA106-150-KA-A1 |
Market Segment Desktop | Market Segment Laptop |
Release Date Oct 14, 2022 | Release Date Feb 25, 2021 |
Foundry TSMC | Foundry Samsung |
Fabrication Node N6 | Fabrication Node 8N |
Die Size 406mm² | Die Size 276mm² |
Transistor Count 21.7 Billion | Transistor Count 13.3 Billion |
Transistor Density 53.45 MTr/mm² | Transistor Density 48.01 MTr/mm² |

