GPUs

Intel Arc A770 vs NVIDIA GeForce RTX 3070 Laptop 80W Full Specs

4,096 Shaders
2.4GHz
5,120 Shaders
1.29GHz
8GB GDDR6512GB/s
8GB GDDR6384GB/s
··
19.66 TFLOPS
··
13.21 TFLOPS
Form Factor
PCIe Card
Form Factor
Soldered
TDP
225W
TDP
80W

Arc A770Arc A770629.1 TOPSINT4 Tensor
x1.49
GeForce RTX 3070 Laptop 80WGeForce RTX 3070 Laptop 80W422.7 TOPSINT4 Tensor Sparse
x1

Clock Speed
···
Clock Speed
···
Peak OPS
629.1 TOPSINT4 Tensor
Peak OPS
422.7 TOPSINT4 Tensor Sparse
Tensor FP16-16
-
FP16-16 Tensor Sparse
-
Tensor FP16-32
157.3 TFLOPS
FP16-32 Tensor Sparse
-
Tensor FP16-16
52.84 TFLOPS
FP16-16 Tensor Sparse
105.7 TFLOPS
Tensor FP16-32
26.42 TFLOPS
FP16-32 Tensor Sparse
52.84 TFLOPS
BF16
-
Tensor BF16
157.3 TFLOPS
BF16 Tensor Sparse
-
BF16
13.21 TFLOPS
Tensor BF16
26.42 TFLOPS
BF16 Tensor Sparse
52.84 TFLOPS
Tensor TF32
-
Tensor TF32
13.21 TFLOPS
FP32
19.66 TFLOPS
FP32
13.21 TFLOPS
FP64
4.92 TFLOPS
FP64
206.4 GFLOPS
Tensor INT4
629.1 TOPS
Tensor INT4
211.4 TOPS
Tensor INT8
314.6 TOPS
Tensor INT8
105.7 TOPS
Ray
-
Ray
19.92 TOPS
Pixel Rate
307.2 GPixel/s
Pixel Rate
103.2 GPixel/s
Texture Rate
614.4 GTexel/s
Texture Rate
206.4 GTexel/s

Shaders
4,096 Shaders
Shaders
5,120 Shaders
TMUs
256 TMUs
TMUs
160 TMUs
ROPs
128 ROPs
ROPs
80 ROPs
Tensor Cores
512 T-Cores
Tensor Cores
160 T-Cores
RT Cores
32 RT-Cores
RT Cores
40 RT-Cores
EUs
512 EUs
SMs
40 SMs

Base Clock
2.1GHz
Base Clock
780MHz
Boost Clock
2.4GHz
Boost Clock
1.29GHz

L2 Cache
8.2MB shared
L2 Cache
4.1MB shared

8GB GDDR6
8GB GDDR6
Memory Bus
256-bit
Memory Bus
256-bit
Memory Speed
16GT/s
Memory Speed
12GT/s
Memory Bandwidth
512GB/s
Memory Bandwidth
384GB/s

TDP
225W
TDP
80W

Multi-Monitor
4
Multi-Monitor
3
HDCP
-
HDCP
HDCP 2.3

3x DisplayPort 2.0
-
1x HDMI 2.1
-

Encoder Model
Arc
Encoder Model
NVENC 7

Decoder Model
Arc
Decoder Model
NVDEC 5

Form Factor
PCIe Card
Form Factor
Soldered
PCIe
2-Slots
PCIe
-
Height
98.4 mm (3.87")
Width
279.9 mm (11.02")
Depth
40 mm (1.57")
-
Cooling
Open-Air
2x Fans
Cooling
Open-Air
-

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
Arc branding
Branding
GeForce RTX 2018 branding
Codename
Xe HPG
Codename
NV174
Chip Variant
DG2-512
Chip Variant
GA104-150-A1
Market Segment
Desktop
Market Segment
Laptop
Release Date
Oct 14, 2022
Release Date
Jan 12, 2021

Foundry
TSMC
Foundry
Samsung
Fabrication Node
N6
Fabrication Node
8N
Die Size
406mm²
Die Size
393mm²
Transistor Count
21.7 Billion
Transistor Count
17.4 Billion
Transistor Density
53.45 MTr/mm²
Transistor Density
44.33 MTr/mm²

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