Intel Arc A770 vs NVIDIA Quadro P1000 Laptop Full Specs

Summary

4,096 Shaders 2.4GHz	512 Shaders 1.52GHz
8GB GDDR6512GB/s	4GB GDDR596GB/s
Peak·FP32·FP16 19.66 TFLOPS	Peak·FP32·FP16 1.55 TFLOPS
Form Factor PCIe Card	Form Factor Soldered
TDP 225W	TDP 40W

Highlights

Peak OPS

Peak OPS FP32 FP16 Tensor FP16-32 FP64 Tensor BF16 Tensor INT8 Tensor INT4 Memory Bandwidth TDP

Arc A770629.1 TOPSINT4 Tensor

x404.48

Quadro P1000 Laptop1.55 TFLOPSFP32

x1

Show Top Score

Theoretical Performance

Clock Speed2400MHz UC·Base·Boost·OC	Clock Speed1519MHz UC·Base·Boost·OC
Peak OPS 629.1 TOPSINT4 Tensor	Peak OPS 1.55 TFLOPSFP32
Tensor FP16-32 157.3 TFLOPS	-
Tensor BF16 157.3 TFLOPS	-
FP32 19.66 TFLOPS	FP32 1.55 TFLOPS
FP64 4.92 TFLOPS	FP64 48.61 GFLOPS
Tensor INT4 629.1 TOPS	Tensor INT4 -
Tensor INT8 314.6 TOPS	-
Pixel Rate 307.2 GPixel/s	Pixel Rate 24.3 GPixel/s
Texture Rate 614.4 GTexel/s	Texture Rate 48.6 GTexel/s

Core Config

Shaders 4,096 Shaders	Shaders 512 Shaders
TMUs 256 TMUs	TMUs 32 TMUs
ROPs 128 ROPs	ROPs 16 ROPs
Tensor Cores 512 T-Cores	Tensor Cores -
RT Cores 32 RT-Cores	RT Cores -
EUs 512 EUs	SMs 4 SMs

Clocks

Base Clock 2.1GHz	Base Clock 1.49GHz
Boost Clock 2.4GHz	Boost Clock 1.52GHz

Cache

L2 Cache 8.2MB shared

L2 Cache 768KB shared

Memory

8GB GDDR6	4GB GDDR5
Memory Bus 256-bit	Memory Bus 128-bit
Memory Speed 16GT/s	Memory Speed 6GT/s
Memory Bandwidth 512GB/s	Memory Bandwidth 96GB/s

Power & Thermals

TDP 225W

TDP 40W

Video Output

Multi-Monitor 4

Multi-Monitor 3

Ports

3x DisplayPort 2.0	-
1x HDMI 2.1	-

Encoder

Encoder Model Arc

Encoder Model NVENC 4

Decoder

Decoder Model Arc

Decoder Model NVDEC 3

Card

Form Factor PCIe Card	Form Factor Soldered
PCIe 2-Slots	PCIe -
Height 98.4 mm (3.87") Width 279.9 mm (11.02") Depth 40 mm (1.57")	-
Cooling Open-Air 2x Fans	Cooling Open-Air -

Chip

Manufacturer Intel	Manufacturer NVIDIA
Chip Designer Intel	Chip Designer NVIDIA
Architecture Alchemist	Architecture Pascal
Family Arc A	Family Quadro P
Branding	Branding
Codename Xe HPG	Codename NV137
Chip Variant DG2-512	Chip Variant GP107-300-A1
Market Segment Desktop	Market Segment Laptop
Release Date Oct 14, 2022	Release Date Feb 7, 2017

Fabrication

Foundry TSMC	Foundry Samsung
Fabrication Node N6	Fabrication Node 14LPP
Die Size 406mm²	Die Size 132mm²
Transistor Count 21.7 Billion	Transistor Count 3.3 Billion
Transistor Density 53.45 MTr/mm²	Transistor Density 25 MTr/mm²

Images

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Competitors

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