GPUs

Intel Arc A770 vs ZOTAC GeForce RTX 3070 Ti AMP Holo Full Specs

4,096 Shaders
2.4GHz
6,144 Shaders
1.83GHz
8GB GDDR6512GB/s
8GB GDDR6X608.3GB/s
··
19.66 TFLOPS
··
22.49 TFLOPS
Form Factor
PCIe Card
Form Factor
PCIe Card
TDP
225W
TDP
310W
Power Connectors
-
Power Connectors
2x 8-Pin

Arc A770Arc A770629.1 TOPSINT4 Tensor
x1
GeForce RTX 3070 Ti AMP HoloGeForce RTX 3070 Ti AMP Holo719.6 TOPSINT4 Tensor Sparse
x1.14

Clock Speed
···
Clock Speed
···
Peak OPS
629.1 TOPSINT4 Tensor
Peak OPS
719.6 TOPSINT4 Tensor Sparse
Tensor FP16-16
-
FP16-16 Tensor Sparse
-
Tensor FP16-32
157.3 TFLOPS
FP16-32 Tensor Sparse
-
Tensor FP16-16
89.95 TFLOPS
FP16-16 Tensor Sparse
179.9 TFLOPS
Tensor FP16-32
44.97 TFLOPS
FP16-32 Tensor Sparse
89.95 TFLOPS
BF16
-
Tensor BF16
157.3 TFLOPS
BF16 Tensor Sparse
-
BF16
22.49 TFLOPS
Tensor BF16
44.97 TFLOPS
BF16 Tensor Sparse
89.95 TFLOPS
Tensor TF32
-
Tensor TF32
22.49 TFLOPS
FP32
19.66 TFLOPS
FP32
22.49 TFLOPS
FP64
4.92 TFLOPS
FP64
351.4 GFLOPS
Tensor INT4
629.1 TOPS
Tensor INT4
359.8 TOPS
Tensor INT8
314.6 TOPS
Tensor INT8
179.9 TOPS
Ray
-
Ray
33.92 TOPS
Pixel Rate
307.2 GPixel/s
Pixel Rate
175.7 GPixel/s
Texture Rate
614.4 GTexel/s
Texture Rate
351.4 GTexel/s

Shaders
4,096 Shaders
Shaders
6,144 Shaders
TMUs
256 TMUs
TMUs
192 TMUs
ROPs
128 ROPs
ROPs
96 ROPs
Tensor Cores
512 T-Cores
Tensor Cores
192 T-Cores
RT Cores
32 RT-Cores
RT Cores
48 RT-Cores
EUs
512 EUs
SMs
48 SMs

Base Clock
2.1GHz
Base Clock
1.57GHz
Boost Clock
2.4GHz
Boost Clock
1.83GHz

L2 Cache
8.2MB shared
L2 Cache
4.1MB shared

8GB GDDR6
8GB GDDR6X
Memory Bus
256-bit
Memory Bus
256-bit
Memory Speed
16GT/s
Memory Speed
19GT/s
Memory Bandwidth
512GB/s
Memory Bandwidth
608.3GB/s

TDP
225W
TDP
310W
Max Temp
-
Max Temp
93°C Max

Multi-Monitor
4
Multi-Monitor
4
HDCP
-
HDCP
HDCP 2.3

3x DisplayPort 2.0
-
-
3x DisplayPort 1.4
1x HDMI 2.1
1x HDMI 2.1

Encoder Model
Arc
Encoder Model
NVENC 7

Decoder Model
Arc
Decoder Model
NVDEC 5

Form Factor
PCIe Card
Form Factor
PCIe Card
PCIe
2-Slots
PCIe
3.2-Slots
Height
98.4 mm (3.87")
Width
279.9 mm (11.02")
Depth
40 mm (1.57")
Height
131.8 mm (5.19")
Width
317.8 mm (12.51")
Depth
64.6 mm (2.54")
Cooling
Open-Air
2x Fans
Cooling
Open-Air
3x Fans
Power Connectors
-
Power Connectors
2x 8-Pin

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
Arc branding
Branding
GeForce RTX 2018 branding
Codename
Xe HPG
Codename
NV174
Chip Variant
DG2-512
Chip Variant
GA104-150-A1
Market Segment
Desktop
Market Segment
Desktop
Release Date
Oct 14, 2022
Release Date
Jun 10, 2021

Foundry
TSMC
Foundry
Samsung
Fabrication Node
N6
Fabrication Node
8N
Die Size
406mm²
Die Size
393mm²
Transistor Count
21.7 Billion
Transistor Count
17.4 Billion
Transistor Density
53.45 MTr/mm²
Transistor Density
44.33 MTr/mm²

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