Intel Arc A770M vs NVIDIA GeForce RTX 3060 Laptop 95W Full Specs
4,096 Shaders 1.65GHz | 3,840 Shaders 1.57GHz |
16GB GDDR6512GB/s | 6GB GDDR6336GB/s |
·· 13.52 TFLOPS | ·· 12.03 TFLOPS |
Form Factor Soldered | Form Factor Soldered |
TDP 120W | TDP 95W |
Clock Speed ··· | Clock Speed ··· |
Peak OPS 432.5 TOPSINT4 Tensor | Peak OPS 385.1 TOPSINT4 Tensor Sparse |
Tensor FP16-16 -FP16-16 Tensor Sparse -Tensor FP16-32 108.1 TFLOPSFP16-32 Tensor Sparse - | Tensor FP16-16 48.14 TFLOPSFP16-16 Tensor Sparse 96.28 TFLOPSTensor FP16-32 24.07 TFLOPSFP16-32 Tensor Sparse 48.14 TFLOPS |
BF16 -Tensor BF16 108.1 TFLOPSBF16 Tensor Sparse - | BF16 12.03 TFLOPSTensor BF16 24.07 TFLOPSBF16 Tensor Sparse 48.14 TFLOPS |
Tensor TF32 - | Tensor TF32 12.03 TFLOPS |
FP32 13.52 TFLOPS | FP32 12.03 TFLOPS |
FP64 3.38 TFLOPS | FP64 188 GFLOPS |
Tensor INT4 432.5 TOPS | Tensor INT4 192.6 TOPS |
Tensor INT8 216.3 TOPS | Tensor INT8 96.28 TOPS |
Ray - | Ray 18.15 TOPS |
Pixel Rate 211.2 GPixel/s | Pixel Rate 75.2 GPixel/s |
Texture Rate 422.4 GTexel/s | Texture Rate 188 GTexel/s |
Shaders 4,096 Shaders | Shaders 3,840 Shaders |
TMUs 256 TMUs | TMUs 120 TMUs |
ROPs 128 ROPs | ROPs 48 ROPs |
Tensor Cores 512 T-Cores | Tensor Cores 120 T-Cores |
RT Cores 32 RT-Cores | RT Cores 30 RT-Cores |
EUs 512 EUs | SMs 30 SMs |
Base Clock 300MHz | Base Clock 1.22GHz |
Boost Clock 1.65GHz | Boost Clock 1.57GHz |
L1 - | L1 64KB/SM Tex |
L2 Cache 8MB shared | L2 Cache 3MB shared |
16GB GDDR6 | 6GB GDDR6 |
Memory Bus 256-bit | Memory Bus 192-bit |
Memory Speed 16GT/s | Memory Speed 14GT/s |
Memory Bandwidth 512GB/s | Memory Bandwidth 336GB/s |
ECC No | ECC No |
TDP 120W | TDP 95W |
Max Resolution 7680x4320 | Max Resolution 7680x4320 |
Refresh Rate Calculator 7680x4320 Resolution8K UHD Refresh Rate 60Hz | Refresh Rate Calculator 7680x4320 Resolution8K UHD Refresh Rate 60Hz |
Multi-Monitor 4 | Multi-Monitor 3 |
Adaptive Sync - FreeSync | Adaptive Sync G-Sync FreeSync |
DSC Not Supported | DSC Supported |
HDCP - | HDCP HDCP 2.3 |
Shader Model 6.6 | Shader Model 6.6 |
DirectX DirectX 12Direct3D 12_2 | DirectX DirectX 12Direct3D 12_2 |
OpenGL 4.6OpenCL 3Vulkan 1.3 | OpenGL 4.6OpenCL 3Vulkan 1.2 |
- | CUDA 8.6PureVideo HD VP11VDPAU Feature Set K |
Encoder Arc | Encoder NVENC 7 |
Codec AVC (H.264) HEVC (H.265) AV1 | Codec AVC (H.264) HEVC (H.265) - |
Decoder Arc | Decoder NVDEC 5 |
Codec - MPEG-2 - JPEG - - VP9 AVC (H.264) HEVC (H.265) AV1 | Codec MPEG-1 MPEG-2 MPEG-4 - VC-1 VP8 VP9 AVC (H.264) HEVC (H.265) AV1 |
Form Factor Soldered | Form Factor Soldered |
PCIe PCIe 4.0 x16 | PCIe PCIe 4.0 x8 |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename Xe HPG | Codename NV176 |
Chip Variant DG2-512 | Chip Variant GA106-150-KA-A1 |
Market Segment Laptop | Market Segment Laptop |
Release Date Jun 28, 2022 | Release Date Feb 25, 2021 |
Foundry TSMC | Foundry Samsung |
Fabrication Node N6 | Fabrication Node 8N |
Die Size 406mm² | Die Size 276mm² |
Transistor Count 21.7B | Transistor Count 13.3B |
Transistor Density 53.45 MTr/mm² | Transistor Density 48.01 MTr/mm² |





