Intel Arc A770M vs NVIDIA GeForce RTX 5060 Laptop 60W Full Specs
4,096 Shaders 1.65GHz | 3,328 Shaders 2.01GHz |
16GB GDDR6512GB/s | 8GB GDDR7354.8GB/s |
·· 13.52 TFLOPS | ·· 13.38 TFLOPS |
Form Factor Soldered | Form Factor Soldered |
TDP 120W | TDP 60W |
Clock Speed ··· | Clock Speed ··· |
Peak OPS 432.5 TOPSINT4 Tensor | Peak OPS 428.1 TFLOPSFP4 Tensor Sparse |
- | Tensor FP4 214.1 TFLOPSFP4 Tensor Sparse 428.1 TFLOPS |
- | Tensor FP8-16 107 TFLOPSFP8-16 Tensor Sparse 214.1 TFLOPSTensor FP8-32 53.51 TFLOPSFP8-32 Tensor Sparse 107 TFLOPS |
Tensor FP16-16 -FP16-16 Tensor Sparse -Tensor FP16-32 108.1 TFLOPSFP16-32 Tensor Sparse - | Tensor FP16-16 53.51 TFLOPSFP16-16 Tensor Sparse 107 TFLOPSTensor FP16-32 26.76 TFLOPSFP16-32 Tensor Sparse 53.51 TFLOPS |
BF16 -Tensor BF16 108.1 TFLOPSBF16 Tensor Sparse - | BF16 13.38 TFLOPSTensor BF16 26.76 TFLOPSBF16 Tensor Sparse 53.51 TFLOPS |
Tensor TF32 - | Tensor TF32 13.38 TFLOPS |
FP32 13.52 TFLOPS | FP32 13.38 TFLOPS |
FP64 3.38 TFLOPS | FP64 209 GFLOPS |
Tensor INT4 432.5 TOPS | Tensor INT4 - |
Tensor INT8 216.3 TOPS | Tensor INT8 107 TOPS |
Ray - | Ray 40.57 TOPS |
Pixel Rate 211.2 GPixel/s | Pixel Rate 64.3 GPixel/s |
Texture Rate 422.4 GTexel/s | Texture Rate 209 GTexel/s |
Shaders 4,096 Shaders | Shaders 3,328 Shaders |
TMUs 256 TMUs | TMUs 104 TMUs |
ROPs 128 ROPs | ROPs 32 ROPs |
Tensor Cores 512 T-Cores | Tensor Cores 104 T-Cores |
RT Cores 32 RT-Cores | RT Cores 26 RT-Cores |
EUs 512 EUs | SMs 26 SMs |
Base Clock 300MHz | Base Clock 1.62GHz |
Boost Clock 1.65GHz | Boost Clock 2.01GHz |
Tensor Clock - | Tensor Clock 2.01GHz |
L2 Cache 8.2MB shared | L2 Cache 32.8MB shared |
16GB GDDR6 | 8GB GDDR7 |
Memory Bus 256-bit | Memory Bus 128-bit |
Memory Speed 16GT/s | Memory Speed 22.2GT/s |
Memory Bandwidth 512GB/s | Memory Bandwidth 354.8GB/s |
ECC No | ECC No |
TDP 120W | TDP 60W |
Multi-Monitor 4 | Multi-Monitor 4 |
HDCP - | HDCP HDCP 2.3 |
Encoder Model Arc | Encoder Model NVENC 9 |
Decoder Model Arc | Decoder Model NVDEC 6 |
Form Factor Soldered | Form Factor Soldered |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename Xe HPG | Codename NV196 |
Chip Variant DG2-512 | Chip Variant - |
Market Segment Laptop | Market Segment Laptop |
Release Date Jun 28, 2022 | Release Date May 5, 2025 |
Foundry TSMC | Foundry TSMC |
Fabrication Node N6 | Fabrication Node 4NP |
Die Size 406mm² | Die Size 183mm² |
Transistor Count 21.7 Billion | Transistor Count 23 Billion |
Transistor Density 53.45 MTr/mm² | Transistor Density 125.7 MTr/mm² |
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