Intel Arc A770M vs NVIDIA Quadro P2200 Full Specs

Summary

4,096 Shaders 1.65GHz	1,280 Shaders 1.49GHz
16GB GDDR6512GB/s	5GB GDDR5X200.2GB/s
Peak·FP32·FP16 13.52 TFLOPS	Peak·FP32·FP16 3.82 TFLOPS
Form Factor Soldered	Form Factor PCIe Card
TDP 120W	TDP 75W

Highlights

Peak OPS

Peak OPS FP32 FP16 Tensor FP16-32 FP64 Tensor BF16 Tensor INT8 Tensor INT4 Memory Bandwidth TDP

Arc A770M432.5 TOPSINT4 Tensor

x113.17

Quadro P22003.82 TFLOPSFP32

x1

Show Top Score

Theoretical Performance

Clock Speed1650MHz UC·Base·Boost·OC	Clock Speed1493MHz UC·Base·Boost·OC
Peak OPS 432.5 TOPSINT4 Tensor	Peak OPS 3.82 TFLOPSFP32
Tensor FP16-32 108.1 TFLOPS	-
Tensor BF16 108.1 TFLOPS	-
FP32 13.52 TFLOPS	FP32 3.82 TFLOPS
FP64 3.38 TFLOPS	FP64 119.4 GFLOPS
Tensor INT4 432.5 TOPS	Tensor INT4 -
Tensor INT8 216.3 TOPS	-
Pixel Rate 211.2 GPixel/s	Pixel Rate 59.7 GPixel/s
Texture Rate 422.4 GTexel/s	Texture Rate 119.4 GTexel/s

Core Config

Shaders 4,096 Shaders	Shaders 1,280 Shaders
TMUs 256 TMUs	TMUs 80 TMUs
ROPs 128 ROPs	ROPs 40 ROPs
Tensor Cores 512 T-Cores	Tensor Cores -
RT Cores 32 RT-Cores	RT Cores -
EUs 512 EUs	SMs 10 SMs

Clocks

Base Clock 300MHz	Base Clock 1GHz
Boost Clock 1.65GHz	Boost Clock 1.49GHz

Cache

L2 Cache 8.2MB shared

L2 Cache 1.5MB shared

Memory

16GB GDDR6	5GB GDDR5X
Memory Bus 256-bit	Memory Bus 160-bit
Memory Speed 16GT/s	Memory Speed 10GT/s
Memory Bandwidth 512GB/s	Memory Bandwidth 200.2GB/s

Power & Thermals

TDP 120W

TDP 75W

Video Output

Multi-Monitor 4

Multi-Monitor 3

Ports

-	4x DisplayPort 1.4

Encoder

Encoder Model Arc

Encoder Model NVENC 4

Decoder

Decoder Model Arc

Decoder Model NVDEC 3

Card

Form Factor Soldered	Form Factor PCIe Card
PCIe -	PCIe 1-Slots
-	Height 111 mm (4.37") Width 201 mm (7.91") Depth 20 mm (0.79")
Cooling Open-Air -	Cooling Blower 1x Fan

Chip

Manufacturer Intel	Manufacturer NVIDIA
Chip Designer Intel	Chip Designer NVIDIA
Architecture Alchemist	Architecture Pascal
Family Arc A	Family Quadro P
Branding	Branding
Codename Xe HPG	Codename NV136
Chip Variant DG2-512	Chip Variant GP106-300-A1
Market Segment Laptop	Market Segment Workstation
Release Date Jun 28, 2022	Release Date Jun 10, 2019

Fabrication

Foundry TSMC	Foundry TSMC
Fabrication Node N6	Fabrication Node 16FF
Die Size 406mm²	Die Size 200mm²
Transistor Count 21.7 Billion	Transistor Count 4.4 Billion
Transistor Density 53.45 MTr/mm²	Transistor Density 22 MTr/mm²

Images

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