Intel Arc B580 vs NVIDIA GeForce RTX 3070 Laptop 115W Full Specs
2,560 Shaders 2.67GHz | 5,120 Shaders 1.56GHz |
12GB GDDR6456GB/s | 8GB GDDR6448GB/s |
·· 13.67 TFLOPS | ·· 15.97 TFLOPS |
Form Factor PCIe Card | Form Factor Soldered |
TDP 190W | TDP 115W |
Power Connectors 1x 8-Pin | Power Connectors - |
Clock Speed ·· | Clock Speed ··· |
Peak OPS 437.5 TOPSINT4 Tensor | Peak OPS 511.2 TOPSINT4 Tensor Sparse |
Tensor FP16-16 -FP16-16 Tensor Sparse -Tensor FP16-32 109.4 TFLOPSFP16-32 Tensor Sparse - | Tensor FP16-16 63.9 TFLOPSFP16-16 Tensor Sparse 127.8 TFLOPSTensor FP16-32 31.95 TFLOPSFP16-32 Tensor Sparse 63.9 TFLOPS |
BF16 -Tensor BF16 109.4 TFLOPSBF16 Tensor Sparse - | BF16 15.97 TFLOPSTensor BF16 31.95 TFLOPSBF16 Tensor Sparse 63.9 TFLOPS |
Tensor TF32 - | Tensor TF32 15.97 TFLOPS |
FP32 13.67 TFLOPS | FP32 15.97 TFLOPS |
FP64 3.42 TFLOPS | FP64 249.6 GFLOPS |
Tensor INT4 437.5 TOPS | Tensor INT4 255.6 TOPS |
Tensor INT8 218.7 TOPS | Tensor INT8 127.8 TOPS |
Ray - | Ray 24.09 TOPS |
Pixel Rate 213.6 GPixel/s | Pixel Rate 124.8 GPixel/s |
Texture Rate 427.2 GTexel/s | Texture Rate 249.6 GTexel/s |
Shaders 2,560 Shaders | Shaders 5,120 Shaders |
TMUs 160 TMUs | TMUs 160 TMUs |
ROPs 80 ROPs | ROPs 80 ROPs |
Tensor Cores 160 T-Cores | Tensor Cores 160 T-Cores |
RT Cores 20 RT-Cores | RT Cores 40 RT-Cores |
EUs 160 EUs | SMs 40 SMs |
Base Clock - | Base Clock 1.11GHz |
Boost Clock 2.67GHz | Boost Clock 1.56GHz |
L2 Cache 18.4MB shared | L2 Cache 4.1MB shared |
12GB GDDR6 | 8GB GDDR6 |
Memory Bus 192-bit | Memory Bus 256-bit |
Memory Speed 19GT/s | Memory Speed 14GT/s |
Memory Bandwidth 456GB/s | Memory Bandwidth 448GB/s |
TDP 190W | TDP 115W |
Multi-Monitor 4 | Multi-Monitor 3 |
HDCP - | HDCP HDCP 2.3 |
3x DisplayPort 2.1 | - |
1x HDMI 2.1 | - |
Encoder Model Arc | Encoder Model NVENC 7 |
Decoder Model Arc | Decoder Model NVDEC 5 |
Form Factor PCIe Card | Form Factor Soldered |
PCIe 2-Slots | PCIe - |
Height 115 mm (4.53")Width 272 mm (10.71")Depth 40 mm (1.57") | - |
Cooling Open-Air 2x Fans | Cooling Open-Air - |
Power Connectors 1x 8-Pin | Power Connectors - |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename Xe2 HPG | Codename NV174 |
Chip Variant - | Chip Variant GA104-150-A1 |
Market Segment Desktop | Market Segment Laptop |
Release Date Dec 3, 2024 | Release Date Jan 12, 2021 |
Foundry TSMC | Foundry Samsung |
Fabrication Node N5 | Fabrication Node 8N |
Die Size 272mm² | Die Size 393mm² |
Transistor Count 19.6 Billion | Transistor Count 17.4 Billion |
Transistor Density 72.06 MTr/mm² | Transistor Density 44.33 MTr/mm² |
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