GPUs

Intel Arc B580 vs Sapphire Radeon RX 6700 XT PULSE Full Specs

2,560 Shaders
2.67GHz
2,560 Shaders
2.58GHz
12GB GDDR6456GB/s
12GB GDDR6384GB/s
··
13.67 TFLOPS
··
13.21 TFLOPS
Form Factor
PCIe Card
Form Factor
PCIe Card
TDP
190W
TDP
230W
Power Connectors
1x 8-Pin
-
Power Connectors
1x 8-Pin
1x 6-Pin

Arc B580Arc B580437.5 TOPSINT4 Tensor
x16.55
Radeon RX 6700 XT PULSERadeon RX 6700 XT PULSE26.43 TFLOPSFP16
x1

Clock Speed
··
Clock Speed
···
Peak OPS
437.5 TOPSINT4 Tensor
Peak OPS
26.43 TFLOPSFP16
Tensor FP16-32
109.4 TFLOPS
-
Tensor BF16
109.4 TFLOPS
-
FP32
13.67 TFLOPS
FP32
13.21 TFLOPS
FP64
3.42 TFLOPS
FP64
825.9 GFLOPS
Tensor INT4
437.5 TOPS
Tensor INT4
-
Tensor INT8
218.7 TOPS
-
Pixel Rate
213.6 GPixel/s
Pixel Rate
165.2 GPixel/s
Texture Rate
427.2 GTexel/s
Texture Rate
413 GTexel/s

Shaders
2,560 Shaders
Shaders
2,560 Shaders
TMUs
160 TMUs
TMUs
160 TMUs
ROPs
80 ROPs
ROPs
64 ROPs
Tensor Cores
160 T-Cores
Tensor Cores
-
RT Cores
20 RT-Cores
RT Cores
40 RT-Cores
EUs
160 EUs
CUs
40 CUs

Base Clock
-
Base Clock
2.46GHz
Boost Clock
2.67GHz
Boost Clock
2.58GHz

L2 Cache
18.4MB shared
L2 Cache
3.1MB shared
L3 Cache
-
L3 Cache
96MB shared
L3 Bandwidth
-
L3 Bandwidth
1.25TB/s

12GB GDDR6
12GB GDDR6
Memory Bus
192-bit
Memory Bus
192-bit
Memory Speed
19GT/s
Memory Speed
16GT/s
Memory Bandwidth
456GB/s
Memory Bandwidth
384GB/s

TDP
190W
TDP
230W
Max Temp
-
Max Temp
110°C Max

Multi-Monitor
4
Multi-Monitor
4
HDCP
-
HDCP
HDCP 2.3

3x DisplayPort 2.1
-
-
3x DisplayPort 1.4
1x HDMI 2.1
1x HDMI 2.1

Encoder Model
Arc
Encoder Model
VCN 3.0

Decoder Model
Arc
Decoder Model
VCN 3.0

Form Factor
PCIe Card
Form Factor
PCIe Card
PCIe
2-Slots
PCIe
2.4-Slots
Height
115 mm (4.53")
Width
272 mm (10.71")
Depth
40 mm (1.57")
Height
119.9 mm (4.72")
Width
260 mm (10.24")
Depth
49 mm (1.93")
Cooling
Open-Air
2x Fans
Cooling
Open-Air
2x Fans
Power Connectors
1x 8-Pin
Power Connectors
1x 8-Pin, 1x 6-Pin

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
Arc branding
Branding
Radeon 2020 branding
Codename
Xe2 HPG
Codename
Navy Flounder
Chip Variant
-
Chip Variant
Navi 22 XT
Market Segment
Desktop
Market Segment
Desktop
Release Date
Dec 3, 2024
Release Date
Mar 18, 2021

Foundry
TSMC
Foundry
TSMC
Fabrication Node
N5
Fabrication Node
N7
Die Size
272mm²
Die Size
335mm²
Transistor Count
19.6 Billion
Transistor Count
17.2 Billion
Transistor Density
72.06 MTr/mm²
Transistor Density
51.34 MTr/mm²

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