Intel Arc Pro A50 vs NVIDIA GeForce RTX 3050 6GB Full Specs
1,024 Shaders 2.35GHz | 2,304 Shaders 1.47GHz |
6GB GDDR6192GB/s | 6GB GDDR6168GB/s |
·· 4.81 TFLOPS | ·· 6.77 TFLOPS |
Form Factor PCIe Card | Form Factor PCIe Card |
TDP 75W | TDP 70W |
Clock Speed ··· | Clock Speed ··· |
Peak OPS 154 TOPSINT4 Tensor | Peak OPS 216.8 TOPSINT4 Tensor Sparse |
Tensor FP16-16 -FP16-16 Tensor Sparse -Tensor FP16-32 38.5 TFLOPSFP16-32 Tensor Sparse - | Tensor FP16-16 27.1 TFLOPSFP16-16 Tensor Sparse 54.19 TFLOPSTensor FP16-32 13.55 TFLOPSFP16-32 Tensor Sparse 27.1 TFLOPS |
BF16 -Tensor BF16 38.5 TFLOPSBF16 Tensor Sparse - | BF16 6.77 TFLOPSTensor BF16 13.55 TFLOPSBF16 Tensor Sparse 27.1 TFLOPS |
Tensor TF32 - | Tensor TF32 6.77 TFLOPS |
FP32 4.81 TFLOPS | FP32 6.77 TFLOPS |
FP64 1.2 TFLOPS | FP64 105.8 GFLOPS |
Tensor INT4 154 TOPS | Tensor INT4 108.4 TOPS |
Tensor INT8 77 TOPS | Tensor INT8 54.19 TOPS |
Ray - | Ray 10.22 TOPS |
Pixel Rate 75.2 GPixel/s | Pixel Rate 47 GPixel/s |
Texture Rate 150.4 GTexel/s | Texture Rate 105.8 GTexel/s |
Shaders 1,024 Shaders | Shaders 2,304 Shaders |
TMUs 64 TMUs | TMUs 72 TMUs |
ROPs 32 ROPs | ROPs 32 ROPs |
Tensor Cores 128 T-Cores | Tensor Cores 72 T-Cores |
RT Cores 8 RT-Cores | RT Cores 18 RT-Cores |
EUs 128 EUs | SMs 18 SMs |
Base Clock 2GHz | Base Clock 1.04GHz |
Boost Clock 2.35GHz | Boost Clock 1.47GHz |
L2 Cache 4.1MB shared | L2 Cache 2MB shared |
6GB GDDR6 | 6GB GDDR6 |
Memory Bus 96-bit | Memory Bus 96-bit |
Memory Speed 16GT/s | Memory Speed 14GT/s |
Memory Bandwidth 192GB/s | Memory Bandwidth 168GB/s |
TDP 75W | TDP 70W |
Multi-Monitor 4 | Multi-Monitor 3 |
HDCP - | HDCP HDCP 2.3 |
- | 3x DisplayPort 1.4 |
4x Mini DisplayPort 2.0 | - |
- | 1x HDMI 2.1 |
Encoder Model Arc | Encoder Model NVENC 7 |
Decoder Model Arc | Decoder Model NVDEC 5 |
Form Factor PCIe Card | Form Factor PCIe Card |
PCIe 2-Slots | PCIe 1.9-Slots |
- | Height 112 mm (4.41")Width 242 mm (9.53")Depth 38 mm (1.5") |
Cooling Blower 1x Fan | Cooling Open-Air 2x Fans |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename Xe HPG | Codename NV177 |
Chip Variant DG2-128 | Chip Variant GA107-140-A1 |
Market Segment Workstation | Market Segment Desktop |
Release Date Aug 8, 2022 | Release Date Feb 2, 2024 |
Foundry TSMC | Foundry Samsung |
Fabrication Node N6 | Fabrication Node 8N |
Die Size 157mm² | Die Size 200mm² |
Transistor Count 7.2 Billion | Transistor Count 8.7 Billion |
Transistor Density 45.86 MTr/mm² | Transistor Density 43.5 MTr/mm² |
No images available
No images available



