Intel Arc Pro A60M vs NVIDIA GeForce RTX 5050 Laptop 100W Full Specs
2,048 Shaders 1.3GHz | 2,560 Shaders 2.13GHz |
8GB GDDR6256GB/s | 8GB GDDR6224GB/s |
·· 5.33 TFLOPS | ·· 10.91 TFLOPS |
Form Factor Soldered | Form Factor Soldered |
TDP 95W | TDP 100W |
Clock Speed ··· | Clock Speed ··· |
Peak OPS 170.4 TOPSINT4 Tensor | Peak OPS 349 TFLOPSFP4 Tensor Sparse |
- | Tensor FP4 174.5 TFLOPSFP4 Tensor Sparse 349 TFLOPS |
- | Tensor FP8-16 87.24 TFLOPSFP8-16 Tensor Sparse 174.5 TFLOPSTensor FP8-32 43.62 TFLOPSFP8-32 Tensor Sparse 87.24 TFLOPS |
Tensor FP16-16 -FP16-16 Tensor Sparse -Tensor FP16-32 42.6 TFLOPSFP16-32 Tensor Sparse - | Tensor FP16-16 43.62 TFLOPSFP16-16 Tensor Sparse 87.24 TFLOPSTensor FP16-32 21.81 TFLOPSFP16-32 Tensor Sparse 43.62 TFLOPS |
BF16 -Tensor BF16 42.6 TFLOPSBF16 Tensor Sparse - | BF16 10.91 TFLOPSTensor BF16 21.81 TFLOPSBF16 Tensor Sparse 43.62 TFLOPS |
Tensor TF32 - | Tensor TF32 10.91 TFLOPS |
FP32 5.33 TFLOPS | FP32 10.91 TFLOPS |
FP64 1.33 TFLOPS | FP64 170.4 GFLOPS |
Tensor INT4 170.4 TOPS | Tensor INT4 - |
Tensor INT8 85.2 TOPS | Tensor INT8 87.24 TOPS |
Ray - | Ray 33.07 TOPS |
Pixel Rate 83.2 GPixel/s | Pixel Rate 68.2 GPixel/s |
Texture Rate 166.4 GTexel/s | Texture Rate 170.4 GTexel/s |
Shaders 2,048 Shaders | Shaders 2,560 Shaders |
TMUs 128 TMUs | TMUs 80 TMUs |
ROPs 64 ROPs | ROPs 32 ROPs |
Tensor Cores 256 T-Cores | Tensor Cores 80 T-Cores |
RT Cores 16 RT-Cores | RT Cores 20 RT-Cores |
EUs 256 EUs | SMs 20 SMs |
Base Clock 900MHz | Base Clock 1.78GHz |
Boost Clock 1.3GHz | Boost Clock 2.13GHz |
Tensor Clock - | Tensor Clock 2.13GHz |
L2 Cache 4.1MB shared | L2 Cache 32.8MB shared |
8GB GDDR6 | 8GB GDDR6 |
Memory Bus 128-bit | Memory Bus 128-bit |
Memory Speed 16GT/s | Memory Speed 14GT/s |
Memory Bandwidth 256GB/s | Memory Bandwidth 224GB/s |
ECC No | ECC No |
TDP 95W | TDP 100W |
Multi-Monitor 4 | Multi-Monitor 4 |
HDCP - | HDCP HDCP 2.3 |
Encoder Model Arc | Encoder Model NVENC 9 |
Decoder Model Arc | Decoder Model NVDEC 6 |
Form Factor Soldered | Form Factor Soldered |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename Xe HPG | Codename NV197 |
Chip Variant DG2-256 | Chip Variant - |
Market Segment Laptop | Market Segment Laptop |
Release Date Jun 6, 2023 | Release Date Jun 24, 2025 |
Foundry TSMC | Foundry TSMC |
Fabrication Node N6 | Fabrication Node 4NP |
Die Size 269mm² | Die Size - |
Transistor Count 11.5 Billion | Transistor Count - |
Transistor Density 42.75 MTr/mm² | Transistor Density - |
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