Intel Flex 170V vs Intel UHD 770 1660MHz Full Specs

Summary

4,096 Shaders 2.05GHz	256 Shaders 1.66GHz
16GB GDDR6576GB/s placeholder	Shared Memory89.6GB/s DDR5·DDR4
Peak·FP32·FP16 -	Peak·FP32·FP16 849.9 GFLOPS
Form Factor PCIe Card	Form Factor iGPU
TDP 150W	TDP Shared

Highlights

Peak OPS

Peak OPS FP32 FP16 FP64 Memory Bandwidth TDP

Flex 170V-

-

UHD 770 1660MHz1.7 TFLOPSFP16

x1

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Theoretical Performance

Clock Speed2050MHz UC·Boost·OC	Clock Speed1660MHz UC·Base·Boost·OC
Peak OPS -	Peak OPS 1.7 TFLOPSFP16
-	FP32 849.9 GFLOPS
-	FP64 212.5 GFLOPS
Pixel Rate -	Pixel Rate 13.3 GPixel/s
Texture Rate -	Texture Rate 26.6 GTexel/s

Core Config

Shaders 4,096 Shaders	Shaders 256 Shaders
TMUs -	TMUs 16 TMUs
ROPs -	ROPs 8 ROPs
Tensor Cores 512 T-Cores	Tensor Cores -
RT Cores 32 RT-Cores	RT Cores -
EUs 512 EUs	EUs 32 EUs

Clocks

Base Clock -	Base Clock 300MHz
Boost Clock 2.05GHz	Boost Clock 1.66GHz
Tensor Clock 1.5GHz	Tensor Clock -

Cache

L1 192KB/Xe-core

L1 -

Memory

16GB GDDR6 placeholder	Shared Memory DDR5·DDR4
Memory Bus 256-bit	Memory Bus 128-bit
Memory Speed 18GT/s	Memory Speed 5.6GT/s
Memory Bandwidth 576GB/s	Memory Bandwidth 89.6GB/s

Power & Thermals

TDP 150W

TDP Shared

Video Output

Max Resolution 7680x4320	Max Resolution 7680x4320
Refresh Rate Calculator 7680x4320 Resolution8K UHD Refresh Rate 60Hz	Refresh Rate Calculator 7680x4320 Resolution8K UHD Refresh Rate 60Hz
Multi-Monitor -	Multi-Monitor 4
Adaptive Sync FreeSync	Adaptive Sync -
DSC -	DSC Supported

API Support

Shader Model 6.6	Shader Model 6.6
DirectX DirectX 12 Direct3D 12_2	DirectX DirectX 12 Direct3D 12_1
OpenGL 4.6 OpenCL 3 Vulkan 1.3	OpenGL 4.6 OpenCL 3 Vulkan 1.2

Encoder

Encoder 2x Flex 170V	Encoder Quick Sync Video 8
Codec JPEG VP9 AVC (H.264) HEVC (H.265) AV1	Codec JPEG VP9 AVC (H.264) HEVC (H.265) AV1

Decoder

Decoder 2x Flex 170V	Decoder Quick Sync Video 8
Codec - MPEG-2 - JPEG - - VP9 AVC (H.264) HEVC (H.265) AV1	Codec MPEG-1 MPEG-2 MPEG-4 JPEG VC-1 VP8 VP9 AVC (H.264) HEVC (H.265) AV1

Card

Form Factor PCIe Card	Form Factor iGPU
PCIe PCIe 4.0 x16	PCIe -
Cooling Open-Air	Cooling Passive

Chip

Manufacturer Intel	Manufacturer Intel
Chip Designer Intel	Chip Designer Intel
Architecture Alchemist	Architecture Gen 12
Family Flex	Family Gen 12
Branding	Branding
Codename Xe HPG	Codename Xe LP
Market Segment Server	Market Segment Desktop
Release Date Jul 1, 2024	Release Date Jan 1, 2025

Fabrication

Foundry TSMC	Foundry Intel
Fabrication Node N6	Fabrication Node Intel 7
Die Size 406mm²	Die Size 257mm²
Transistor Count 21.7B	Transistor Count 18.5B
Transistor Density 53.45 MTr/mm²	Transistor Density 72 MTr/mm²

Images