Intel Graphics 2C 2300MHz vs NVIDIA GeForce GTX 850M GDDR5 Full Specs

Summary

256 Shaders 2.3GHz	640 Shaders 876MHz
Shared Memory119.5GB/s LPDDR5X·DDR5	2GB GDDR580GB/s placeholder
Peak·FP32·FP16 1.18 TFLOPS	Peak·FP32·FP16 1.12 TFLOPS
Form Factor iGPU	Form Factor Soldered
TDP Shared	TDP 40W

Highlights

Peak OPS

Peak OPS FP32 FP16 Tensor FP16-32 FP64 Tensor BF16 Tensor INT8 Tensor INT4 Memory Bandwidth TDP

Graphics 2C 2300MHz37.68 TOPSINT4 Tensor

x33.61

GeForce GTX 850M GDDR51.12 TFLOPSFP32

x1

Show Top Score

Theoretical Performance

Clock Speed2300MHz UC·Boost·OC	Clock Speed876MHz UC·Boost·OC
Peak OPS 37.68 TOPSINT4 Tensor	Peak OPS 1.12 TFLOPSFP32
Tensor FP16-32 9.42 TFLOPS	-
Tensor BF16 9.42 TFLOPS	-
FP32 1.18 TFLOPS	FP32 1.12 TFLOPS
FP64 294.4 GFLOPS	FP64 35.04 GFLOPS
Tensor INT4 37.68 TOPS	Tensor INT4 -
Tensor INT8 18.84 TOPS	-
Pixel Rate 18.4 GPixel/s	Pixel Rate 14 GPixel/s
Texture Rate 36.8 GTexel/s	Texture Rate 35 GTexel/s

Core Config

Shaders 256 Shaders	Shaders 640 Shaders
TMUs 16 TMUs	TMUs 40 TMUs
ROPs 8 ROPs	ROPs 16 ROPs
Tensor Cores 16 T-Cores	Tensor Cores -
RT Cores 2 RT-Cores	RT Cores -
EUs 16 EUs	SMs 5 SMs

Clocks

Boost Clock 2.3GHz

Boost Clock 876MHz

Cache

L2 Cache 4.1MB shared

L2 Cache 2MB shared

Memory

Shared Memory LPDDR5X·DDR5	2GB GDDR5 placeholder
Memory Bus 128-bit	Memory Bus 128-bit
Memory Speed 7.5GT/s	Memory Speed 5GT/s
Memory Bandwidth 119.5GB/s	Memory Bandwidth 80GB/s
ECC No	ECC No

Power & Thermals

TDP Shared

TDP 40W

Video Output

Multi-Monitor 3

Multi-Monitor 2

Encoder

Encoder Model Xe Media Engine

Encoder Model NVENC 2

Decoder

Decoder Model Xe Media Engine

Decoder Model NVDEC 1

Card

Form Factor iGPU

Form Factor Soldered

Chip

Manufacturer Intel	Manufacturer NVIDIA
Chip Designer Intel	Chip Designer NVIDIA
Architecture Battlemage	Architecture Maxwell
Family Gen 13	Family GeForce 800
Branding	Branding
Codename Xe3 LPG	Codename NV117
Chip Variant GT1	Chip Variant GM107-220-A2
Market Segment Laptop	Market Segment Laptop
Release Date Jan 5, 2026	Release Date Mar 12, 2014

Fabrication

Foundry Intel	Foundry TSMC
Fabrication Node Intel 3	Fabrication Node 28nm
Die Size 27mm²	Die Size 148mm²
Transistor Count -	Transistor Count 1.9 Billion
Transistor Density -	Transistor Density 12.64 MTr/mm²

Images

No images available

No images available

Used In

CPUs Core Ultra 5 322 Core Ultra 5 332

CPUs -

Competitors

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