Intel Graphics 2C 2300MHz vs AMD Radeon 840M 2900MHz Full Specs

Summary

256 Shaders 2.3GHz	256 Shaders 2.9GHz
Shared Memory119.5GB/s LPDDR5X·DDR5	Shared Memory128GB/s LPDDR5X·DDR5
Peak·FP32·FP16 1.18 TFLOPS	Peak·FP32·FP16 1.49 TFLOPS
Form Factor iGPU	Form Factor iGPU
TDP Shared	TDP Shared

Highlights

Peak OPS

Peak OPS FP32 FP16 Tensor FP16-32 FP64 BF16 Tensor BF16 Tensor INT8 Tensor INT4 Memory Bandwidth

Graphics 2C 2300MHz37.68 TOPSINT4 Tensor

x12.69

Radeon 840M 2900MHz2.97 TFLOPSFP16

x1

Show Top Score

Theoretical Performance

Clock Speed2300MHz UC·Boost·OC	Clock Speed2900MHz UC·Base·Boost·OC
Peak OPS 37.68 TOPSINT4 Tensor	Peak OPS 2.97 TFLOPSFP16
Tensor FP16-32 9.42 TFLOPS	-
BF16 - Tensor BF16 9.42 TFLOPS	BF16 2.97 TFLOPS Tensor BF16 -
FP32 1.18 TFLOPS	FP32 1.49 TFLOPS
FP64 294.4 GFLOPS	FP64 92.8 GFLOPS
Tensor INT4 37.68 TOPS	Tensor INT4 -
Tensor INT8 18.84 TOPS	-
Pixel Rate 18.4 GPixel/s	Pixel Rate 92.8 GPixel/s
Texture Rate 36.8 GTexel/s	Texture Rate 46.4 GTexel/s

Core Config

Shaders 256 Shaders	Shaders 256 Shaders
TMUs 16 TMUs	TMUs 16 TMUs
ROPs 8 ROPs	ROPs 32 ROPs
Tensor Cores 16 T-Cores	Tensor Cores -
RT Cores 2 RT-Cores	RT Cores 4 RT-Cores
EUs 16 EUs	CUs 4 CUs

Clocks

Base Clock -	Base Clock 1.5GHz
Boost Clock 2.3GHz	Boost Clock 2.9GHz

Cache

L2 Cache 4.1MB shared

L2 Cache -

Memory

Shared Memory LPDDR5X·DDR5	Shared Memory LPDDR5X·DDR5
Memory Bus 128-bit	Memory Bus 128-bit
Memory Speed 7.5GT/s	Memory Speed 8GT/s
Memory Bandwidth 119.5GB/s	Memory Bandwidth 128GB/s

Video Output

Multi-Monitor 3	Multi-Monitor 4
HDCP -	HDCP HDCP 2.3

Encoder

Encoder Model Xe Media Engine

Encoder Model VCN 4.0

Decoder

Decoder Model Xe Media Engine

Decoder Model VCN 4.0

Card

Form Factor iGPU

Form Factor iGPU

Chip

Manufacturer Intel	Manufacturer AMD
Chip Designer Intel	Chip Designer AMD
Architecture Battlemage	Architecture RDNA 3.5
Family Gen 13	Family 800
Branding	Branding
Codename Xe3 LPG	Codename Strix Point
Chip Variant GT1	Chip Variant -
Market Segment Laptop	Market Segment Laptop
Release Date Jan 5, 2026	Release Date Jan 6, 2025

Fabrication

Foundry Intel	Foundry TSMC
Fabrication Node Intel 3	Fabrication Node N4P
Die Size 27mm²	Die Size 233mm²
Transistor Count -	Transistor Count 28 Billion
Transistor Density -	Transistor Density 120 MTr/mm²

Images

No images available

No images available

Used In

CPUs Core Ultra 5 322 Core Ultra 5 332	CPUs Ryzen AI 5 340 Ryzen AI 5 PRO 340
Laptops -	Laptops Framework 13(Early 2025)

Competitors

IntelGraphics 2C 2300MHz vs GPU IntelGraphics 4C 2500MHz IntelGraphics 2C 2300MHz vs GPU IntelArc B390 2500MHz IntelGraphics 2C 2300MHz vs GPU IntelGraphics 4C 2450MHz Show 12 more

AMDRadeon 840M 2900MHz vs GPU AMDRadeon 860M 3000MHz AMDRadeon 840M 2900MHz vs GPU Apple4-Core A16 AMDRadeon 840M 2900MHz vs GPU Apple4-Core A18 Show 12 more