Intel Graphics 2C 2300MHz vs NVIDIA GeForce MX110 Full Specs

Summary

256 Shaders 2.3GHz	256 Shaders 993MHz
Shared Memory119.5GB/s LPDDR5X·DDR5	2GB DDR314.4GB/s placeholder
Peak·FP32·FP16 1.18 TFLOPS	Peak·FP32·FP16 508.4 GFLOPS
Form Factor iGPU	Form Factor Soldered
TDP Shared	TDP 30W

Highlights

Peak OPS

Peak OPS FP32 FP16 Tensor FP16-32 FP64 Tensor BF16 Tensor INT8 Tensor INT4 Memory Bandwidth TDP

Graphics 2C 2300MHz37.68 TOPSINT4 Tensor

x74.12

GeForce MX110508.4 GFLOPSFP32

x1

Show Top Score

Theoretical Performance

Clock Speed2300MHz UC·Boost·OC	Clock Speed993MHz UC·Base·Boost·OC
Peak OPS 37.68 TOPSINT4 Tensor	Peak OPS 508.4 GFLOPSFP32
Tensor FP16-32 9.42 TFLOPS	-
Tensor BF16 9.42 TFLOPS	-
FP32 1.18 TFLOPS	FP32 508.4 GFLOPS
FP64 294.4 GFLOPS	FP64 15.89 GFLOPS
Tensor INT4 37.68 TOPS	Tensor INT4 -
Tensor INT8 18.84 TOPS	-
Pixel Rate 18.4 GPixel/s	Pixel Rate 7.9 GPixel/s
Texture Rate 36.8 GTexel/s	Texture Rate 15.9 GTexel/s

Core Config

Shaders 256 Shaders	Shaders 256 Shaders
TMUs 16 TMUs	TMUs 16 TMUs
ROPs 8 ROPs	ROPs 8 ROPs
Tensor Cores 16 T-Cores	Tensor Cores -
RT Cores 2 RT-Cores	RT Cores -
EUs 16 EUs	SMs 3 SMs

Clocks

Base Clock -	Base Clock 965MHz
Boost Clock 2.3GHz	Boost Clock 993MHz

Cache

L2 Cache 4.1MB shared

L2 Cache 1MB shared

Memory

Shared Memory LPDDR5X·DDR5	2GB DDR3 placeholder
Memory Bus 128-bit	Memory Bus 64-bit
Memory Speed 7.5GT/s	Memory Speed 1.8GT/s
Memory Bandwidth 119.5GB/s	Memory Bandwidth 14.4GB/s

Power & Thermals

TDP Shared

TDP 30W

Video Output

Multi-Monitor 3	Multi-Monitor 2
HDCP -	HDCP HDCP 2.2

Encoder

Encoder Model Xe Media Engine

-

Decoder

Decoder Model Xe Media Engine

-

Card

Form Factor iGPU

Form Factor Soldered

Chip

Manufacturer Intel	Manufacturer NVIDIA
Chip Designer Intel	Chip Designer NVIDIA
Architecture Battlemage	Architecture Maxwell
Family Gen 13	Family GeForce MX
Branding	Branding
Codename Xe3 LPG	Codename NV118
Chip Variant GT1	Chip Variant -
Market Segment Laptop	Market Segment Laptop
Release Date Jan 5, 2026	Release Date Nov 17, 2017

Fabrication

Foundry Intel	Foundry TSMC
Fabrication Node Intel 3	Fabrication Node 28nm
Die Size 27mm²	Die Size 89mm²
Transistor Count -	Transistor Count 1.1 Billion
Transistor Density -	Transistor Density 12.61 MTr/mm²

Images

No images available

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Used In

CPUs Core Ultra 5 322 Core Ultra 5 332

CPUs -

Competitors

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NVIDIAGeForce MX110 vs GPU QualcommAdreno 722 NVIDIAGeForce MX110 vs GPU AMDRadeon 840M 2900MHz NVIDIAGeForce MX110 vs GPU NVIDIAGeForce RTX 5050 Laptop 60W Show 12 more