Intel Graphics 2C 2300MHz vs NVIDIA GeForce MX250 10W Full Specs

Summary

256 Shaders 2.3GHz	384 Shaders 1.04GHz
Shared Memory119.5GB/s LPDDR5X·DDR5	2GB GDDR556GB/s placeholder
Peak·FP32·FP16 1.18 TFLOPS	Peak·FP32·FP16 797.2 GFLOPS
Form Factor iGPU	Form Factor Soldered
TDP Shared	TDP 10W

Highlights

Peak OPS

Peak OPS FP32 FP16 Tensor FP16-32 FP64 Tensor BF16 Tensor INT8 Tensor INT4 Memory Bandwidth TDP

Graphics 2C 2300MHz37.68 TOPSINT4 Tensor

x47.27

GeForce MX250 10W797.2 GFLOPSFP32

x1

Show Top Score

Theoretical Performance

Clock Speed2300MHz UC·Boost·OC	Clock Speed1038MHz UC·Base·Boost·OC
Peak OPS 37.68 TOPSINT4 Tensor	Peak OPS 797.2 GFLOPSFP32
Tensor FP16-32 9.42 TFLOPS	-
Tensor BF16 9.42 TFLOPS	-
FP32 1.18 TFLOPS	FP32 797.2 GFLOPS
FP64 294.4 GFLOPS	FP64 24.91 GFLOPS
Tensor INT4 37.68 TOPS	Tensor INT4 -
Tensor INT8 18.84 TOPS	-
Pixel Rate 18.4 GPixel/s	Pixel Rate 16.6 GPixel/s
Texture Rate 36.8 GTexel/s	Texture Rate 24.9 GTexel/s

Core Config

Shaders 256 Shaders	Shaders 384 Shaders
TMUs 16 TMUs	TMUs 24 TMUs
ROPs 8 ROPs	ROPs 16 ROPs
Tensor Cores 16 T-Cores	Tensor Cores -
RT Cores 2 RT-Cores	RT Cores -
EUs 16 EUs	SMs 3 SMs

Clocks

Base Clock -	Base Clock 937MHz
Boost Clock 2.3GHz	Boost Clock 1.04GHz

Cache

L2 Cache 4.1MB shared

L2 Cache 512KB shared

Memory

Shared Memory LPDDR5X·DDR5	2GB GDDR5 placeholder
Memory Bus 128-bit	Memory Bus 64-bit
Memory Speed 7.5GT/s	Memory Speed 7GT/s
Memory Bandwidth 119.5GB/s	Memory Bandwidth 56GB/s

Power & Thermals

TDP Shared

TDP 10W

Video Output

Multi-Monitor 3	Multi-Monitor 2
HDCP -	HDCP HDCP 2.2

Encoder

Encoder Model Xe Media Engine

-

Decoder

Decoder Model Xe Media Engine

Decoder Model NVDEC 3

Card

Form Factor iGPU

Form Factor Soldered

Chip

Manufacturer Intel	Manufacturer NVIDIA
Chip Designer Intel	Chip Designer NVIDIA
Architecture Battlemage	Architecture Pascal
Family Gen 13	Family GeForce MX
Branding	Branding
Codename Xe3 LPG	Codename NV138
Chip Variant GT1	Chip Variant GP108-200-A1
Market Segment Laptop	Market Segment Laptop
Release Date Jan 5, 2026	Release Date Feb 20, 2019

Fabrication

Foundry Intel	Foundry Samsung
Fabrication Node Intel 3	Fabrication Node 14LPP
Die Size 27mm²	Die Size 74mm²
Transistor Count -	Transistor Count 1.8 Billion
Transistor Density -	Transistor Density 24.32 MTr/mm²

Images

No images available

No images available

Used In

CPUs Core Ultra 5 322 Core Ultra 5 332

CPUs -

Competitors

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