Intel Graphics 4C 2500MHz vs NVIDIA GeForce MX350 Full Specs

Summary

512 Shaders 2.5GHz	640 Shaders 1.47GHz
Shared Memory136.5GB/s LPDDR5X·DDR5	2GB GDDR556GB/s placeholder
Peak·FP32·FP16 2.56 TFLOPS	Peak·FP32·FP16 1.88 TFLOPS
Form Factor iGPU	Form Factor Soldered
TDP Shared	TDP 20W

Highlights

Peak OPS

Peak OPS FP32 FP16 Tensor FP16-32 FP64 Tensor BF16 Tensor INT8 Tensor INT4 Memory Bandwidth TDP

Graphics 4C 2500MHz81.92 TOPSINT4 Tensor

x43.60

GeForce MX3501.88 TFLOPSFP32

x1

Show Top Score

Theoretical Performance

Clock Speed2500MHz UC·Boost·OC	Clock Speed1468MHz UC·Base·Boost·OC
Peak OPS 81.92 TOPSINT4 Tensor	Peak OPS 1.88 TFLOPSFP32
Tensor FP16-32 20.48 TFLOPS	-
Tensor BF16 20.48 TFLOPS	-
FP32 2.56 TFLOPS	FP32 1.88 TFLOPS
FP64 640 GFLOPS	FP64 58.72 GFLOPS
Tensor INT4 81.92 TOPS	Tensor INT4 -
Tensor INT8 40.96 TOPS	-
Pixel Rate 40 GPixel/s	Pixel Rate 23.5 GPixel/s
Texture Rate 80 GTexel/s	Texture Rate 47 GTexel/s

Core Config

Shaders 512 Shaders	Shaders 640 Shaders
TMUs 32 TMUs	TMUs 32 TMUs
ROPs 16 ROPs	ROPs 16 ROPs
Tensor Cores 32 T-Cores	Tensor Cores -
RT Cores 4 RT-Cores	RT Cores -
EUs 32 EUs	SMs 5 SMs

Clocks

Base Clock -	Base Clock 1.35GHz
Boost Clock 2.5GHz	Boost Clock 1.47GHz

Cache

L2 Cache 4.1MB shared

L2 Cache 512KB shared

Memory

Shared Memory LPDDR5X·DDR5	2GB GDDR5 placeholder
Memory Bus 128-bit	Memory Bus 64-bit
Memory Speed 8.5GT/s	Memory Speed 7GT/s
Memory Bandwidth 136.5GB/s	Memory Bandwidth 56GB/s

Power & Thermals

TDP Shared

TDP 20W

Video Output

Multi-Monitor 3	Multi-Monitor 2
HDCP -	HDCP HDCP 2.2

Encoder

Encoder Model Xe Media Engine

-

Decoder

Decoder Model Xe Media Engine

Decoder Model NVDEC 3

Card

Form Factor iGPU

Form Factor Soldered

Chip

Manufacturer Intel	Manufacturer NVIDIA
Chip Designer Intel	Chip Designer NVIDIA
Architecture Battlemage	Architecture Pascal
Family Gen 13	Family GeForce MX
Branding	Branding
Codename Xe3 LPG	Codename NV137
Chip Variant GT1	Chip Variant GP107-300-A1
Market Segment Laptop	Market Segment Laptop
Release Date Jan 5, 2026	Release Date Feb 12, 2020

Fabrication

Foundry Intel	Foundry Samsung
Fabrication Node Intel 3	Fabrication Node 14LPP
Die Size 27mm²	Die Size 132mm²
Transistor Count -	Transistor Count 3.3 Billion
Transistor Density -	Transistor Density 25 MTr/mm²

Images

No images available

No images available

Used In

CPUs Core Ultra 7 355 Core Ultra 7 365 Core Ultra 7 366H Show 1 more	CPUs -
All-in-Ones -	All-in-Ones Pavilion 27(Early 2021)

Competitors

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