Intel Graphics 4C 2500MHz vs Qualcomm Adreno 680 Full Specs

Summary

512 Shaders 2.5GHz	1,536 Shaders 600MHz
Shared Memory136.5GB/s LPDDR5X·DDR5	Shared Memory68.3GB/sLPDDR4X
Peak·FP32·FP16 2.56 TFLOPS	Peak·FP32·FP16 1.84 TFLOPS
Form Factor iGPU	Form Factor iGPU
TDP Shared	TDP 5W

Highlights

Peak OPS

Peak OPS FP32 FP16 Tensor FP16-32 FP64 Tensor BF16 Tensor INT8 Tensor INT4 Memory Bandwidth TDP

Graphics 4C 2500MHz81.92 TOPSINT4 Tensor

x22.22

Adreno 6803.69 TFLOPSFP16

x1

Show Top Score

Theoretical Performance

Clock Speed2500MHz UC·Boost·OC	Clock Speed600MHz UC·Boost·OC
Peak OPS 81.92 TOPSINT4 Tensor	Peak OPS 3.69 TFLOPSFP16
Tensor FP16-32 20.48 TFLOPS	-
Tensor BF16 20.48 TFLOPS	-
FP32 2.56 TFLOPS	FP32 1.84 TFLOPS
FP64 640 GFLOPS	FP64 460.8 GFLOPS
Tensor INT4 81.92 TOPS	Tensor INT4 -
Tensor INT8 40.96 TOPS	-
Pixel Rate 40 GPixel/s	Pixel Rate 28.8 GPixel/s
Texture Rate 80 GTexel/s	Texture Rate 57.6 GTexel/s

Core Config

Shaders 512 Shaders	Shaders 1,536 Shaders
TMUs 32 TMUs	TMUs 96 TMUs
ROPs 16 ROPs	ROPs 48 ROPs
Tensor Cores 32 T-Cores	Tensor Cores -
RT Cores 4 RT-Cores	RT Cores -
EUs 32 EUs	EUs 12 EUs

Clocks

Boost Clock 2.5GHz

Boost Clock 600MHz

Cache

L2 Cache 4.1MB shared	L2 Cache 512KB shared
L3 Cache -	L3 Cache 3MB shared

Memory

Shared Memory LPDDR5X·DDR5	Shared MemoryLPDDR4X
Memory Bus 128-bit	Memory Bus 128-bit
Memory Speed 8.5GT/s	Memory Speed 4.3GT/s
Memory Bandwidth 136.5GB/s	Memory Bandwidth 68.3GB/s

Power & Thermals

TDP Shared

TDP 5W

Video Output

Multi-Monitor 3

Multi-Monitor 1

Encoder

Encoder Model Xe Media Engine

Encoder Model Hexagon 690

Decoder

Decoder Model Xe Media Engine

Decoder Model Hexagon 690

Card

Form Factor iGPU

Form Factor iGPU

Chip

Manufacturer Intel	Manufacturer Qualcomm
Chip Designer Intel	Chip Designer Qualcomm
Architecture Battlemage	Architecture Adreno 600
Family Gen 13	Family Adreno 600
Branding	Branding
Codename Xe3 LPG	Codename -
Chip Variant GT1	Chip Variant -
Market Segment Laptop	Market Segment Smartphone
Release Date Jan 5, 2026	Release Date Jul 9, 2019

Fabrication

Foundry Intel	Foundry TSMC
Fabrication Node Intel 3	Fabrication Node N7
Die Size 27mm²	Die Size -

Images

No images available

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Used In

CPUs Core Ultra 7 355 Core Ultra 7 365 Core Ultra 7 366H Show 1 more	CPUs Snapdragon 8cx Gen 1
Laptops -	Laptops Galaxy Book S(Mid 2019)

Competitors

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