Intel HD 3000 1200MHz vs Apple FirePro D300 Full Specs
96 Shaders 1.2GHz | 1,280 Shaders 850MHz |
Shared Memory25.6GB/sDDR3 | 2GB GDDR5162.6GB/s placeholder |
·· 230.4 GFLOPS | ·· 2.18 TFLOPS |
Form Factor iGPU | Form Factor Mac Pro Card |
TDP Shared | TDP 150W |
HD 3000 1200MHz230.4 GFLOPSFP32
FirePro D3002.18 TFLOPSFP32Clock Speed ··· | Clock Speed ·· |
Peak OPS 230.4 GFLOPSFP32 | Peak OPS 2.18 TFLOPSFP32 |
FP32 230.4 GFLOPS | FP32 2.18 TFLOPS |
- | FP64 136 GFLOPS |
Pixel Rate 2.4 GPixel/s | Pixel Rate 27.2 GPixel/s |
Texture Rate 14.4 GTexel/s | Texture Rate 68 GTexel/s |
Shaders 96 Shaders | Shaders 1,280 Shaders |
TMUs 12 TMUs | TMUs 80 TMUs |
ROPs 2 ROPs | ROPs 32 ROPs |
EUs 12 EUs | CUs 20 CUs |
Base Clock 650MHz | Base Clock - |
Boost Clock 1.2GHz | Boost Clock 850MHz |
L2 Cache - | L2 Cache 512KB shared |
Shared MemoryDDR3 | 2GB GDDR5 placeholder |
Memory Bus 128-bit | Memory Bus 256-bit |
Memory Speed 1.6GT/s | Memory Speed 5.1GT/s |
Memory Bandwidth 25.6GB/s | Memory Bandwidth 162.6GB/s |
ECC No | ECC No |
TDP Shared | TDP 150W |
Multi-Monitor 2 | Multi-Monitor 3 |
Encoder Model Quick Sync Video 1 | Encoder Model VCE 1.0 |
Decoder Model Quick Sync Video 1 | Decoder Model UVD 4.0 |
Form Factor iGPU | Form Factor Mac Pro Card |
Cooling Open-Air | Cooling Passive |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding  | Branding  |
Codename Sandy Bridge | Codename Pitcairn |
Chip Variant GT1 | Chip Variant Pitcairn Pro |
Market Segment Smartphone | Market Segment Workstation |
Release Date Feb 1, 2011 | Release Date Jan 18, 2014 |
Foundry Intel | Foundry TSMC |
Fabrication Node 32nm | Fabrication Node 28nm |
Die Size 216mm² | Die Size 212mm² |
Transistor Count 1.2 Billion | Transistor Count 2.8 Billion |
Transistor Density 5 MTr/mm² | Transistor Density 13.21 MTr/mm² |
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