GPUs

Intel HD 4400 1150MHz vs Apple 16-Core M4 Pro Full Specs

160 Shaders
1.15GHz
2,048 Shaders
1.58GHz
Shared Memory25.6GB/s
·
Shared Memory273.1GB/sLPDDR5X
··
368 GFLOPS
··
6.46 TFLOPS
Form Factor
iGPU
Form Factor
iGPU
TDP
Shared
TDP
Shared

HD 4400 1150MHzHD 4400 1150MHz368 GFLOPSFP32
x1
16-Core M4 Pro16-Core M4 Pro6.46 TFLOPSFP16
x17.56

Clock Speed
···
Clock Speed
··
Peak OPS
368 GFLOPSFP32
Peak OPS
6.46 TFLOPSFP16
FP32
368 GFLOPS
FP32
6.46 TFLOPS
FP64
92 GFLOPS
-
Pixel Rate
2.3 GPixel/s
Pixel Rate
101 GPixel/s
Texture Rate
23 GTexel/s
Texture Rate
202 GTexel/s

Shaders
160 Shaders
Shaders
2,048 Shaders
TMUs
20 TMUs
TMUs
128 TMUs
ROPs
2 ROPs
ROPs
64 ROPs
RT Cores
-
RT Cores
16 RT-Cores
EUs
20 EUs
EUs
256 EUs

Base Clock
350MHz
Base Clock
-
Boost Clock
1.15GHz
Boost Clock
1.58GHz

L2 Cache
-
L2 Cache
4.1MB shared

Shared Memory
·
Shared MemoryLPDDR5X
Memory Bus
128-bit
Memory Bus
256-bit
Memory Speed
1.6GT/s
Memory Speed
8.5GT/s
Memory Bandwidth
25.6GB/s
Memory Bandwidth
273.1GB/s
ECC
No
ECC
No

Multi-Monitor
2
Multi-Monitor
3

Encoder Model
Quick Sync Video 3
Encoder Model
Apple Media Engine 3

Decoder Model
Quick Sync Video 3
Decoder Model
Apple Media Engine 3

Form Factor
iGPU
Form Factor
iGPU
Cooling
Passive
Cooling
Open-Air

Manufacturer
Manufacturer
Chip Designer
Chip Designer
Architecture
Architecture
Family
Family
Branding
HD 2013 branding
Branding
M4 Pro branding
Codename
Haswell
Codename
G16S
Chip Variant
GT1
Chip Variant
-
Market Segment
Desktop
Market Segment
Laptop
Release Date
Sep 3, 2013
Release Date
Oct 29, 2024

Foundry
Intel
Foundry
TSMC
Fabrication Node
22nm
Fabrication Node
N3E
Die Size
131mm²
Die Size
325mm²
Transistor Count
960 Million
Transistor Count
55 Billion
Transistor Density
7 MTr/mm²
Transistor Density
169 MTr/mm²

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