Intel HD 615 850MHz vs Qualcomm Adreno 685 Full Specs
192 Shaders 850MHz | 1,536 Shaders 590MHz |
Shared Memory29.9GB/s · | Shared Memory68.3GB/sLPDDR4X |
·· 326.4 GFLOPS | ·· 1.81 TFLOPS |
Form Factor iGPU | Form Factor iGPU |
TDP Shared | TDP 5W |
Clock Speed ··· | Clock Speed ··· |
Peak OPS 326.4 GFLOPSFP16 | Peak OPS 3.63 TFLOPSFP16 |
FP32 326.4 GFLOPS | FP32 1.81 TFLOPS |
FP64 81.6 GFLOPS | FP64 453.1 GFLOPS |
Pixel Rate 2.5 GPixel/s | Pixel Rate 28.3 GPixel/s |
Texture Rate 20.4 GTexel/s | Texture Rate 56.6 GTexel/s |
Shaders 192 Shaders | Shaders 1,536 Shaders |
TMUs 24 TMUs | TMUs 96 TMUs |
ROPs 3 ROPs | ROPs 48 ROPs |
EUs 24 EUs | EUs 12 EUs |
Base Clock 300MHz | Base Clock 250MHz |
Boost Clock 850MHz | Boost Clock 590MHz |
L2 Cache - | L2 Cache 512KB shared |
L3 Cache - | L3 Cache 3MB shared |
Shared Memory · | Shared MemoryLPDDR4X |
Memory Bus 128-bit | Memory Bus 128-bit |
Memory Speed 1.9GT/s | Memory Speed 4.3GT/s |
Memory Bandwidth 29.9GB/s | Memory Bandwidth 68.3GB/s |
ECC No | ECC No |
TDP Shared | TDP 5W |
Multi-Monitor 3 | Multi-Monitor 1 |
Encoder Model Quick Sync Video 6 | Encoder Model Hexagon 690 |
Decoder Model Quick Sync Video 6 | Decoder Model Hexagon 690 |
Form Factor iGPU | Form Factor iGPU |
Cooling Passive | Cooling Open-Air |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename Kaby Lake | Codename - |
Chip Variant GT1 | Chip Variant - |
Market Segment Desktop | Market Segment Smartphone |
Release Date Jan 3, 2017 | Release Date Oct 2, 2019 |
Foundry Intel | Foundry TSMC |
Fabrication Node 14nm+ | Fabrication Node N7 |
Die Size 103mm² | Die Size - |
Transistor Count 1.8 Billion | Transistor Count - |
Transistor Density 17 MTr/mm² | Transistor Density - |
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