Intel Iris Plus 655 1200MHz vs Apple 4-Core A19 Full Specs

Summary

384 Shaders 1.2GHz	512 Shaders 1.47GHz
Shared Memory42.7GB/s DDR4·LPDDR3	Shared Memory68.3GB/sLPDDR5X
Peak·FP32·FP16 921.6 GFLOPS	Peak·FP32·FP16 1.5 TFLOPS
Form Factor iGPU	Form Factor iGPU
TDP Shared	TDP Shared

Highlights

Peak OPS

Peak OPS FP32 FP16 Tensor FP8-16 Tensor FP8-32 Tensor FP16-16 Tensor FP16-32 FP64 Memory Bandwidth

Iris Plus 655 1200MHz1.84 TFLOPSFP16

x1

4-Core A193.01 TFLOPSFP8-16 Tensor

x1.63

Show Top Score

Theoretical Performance

Clock Speed1200MHz UC·Base·Boost·OC	Clock Speed1470MHz UC·Boost·OC
Peak OPS 1.84 TFLOPSFP16	Peak OPS 3.01 TFLOPSFP8-16 Tensor
-	Tensor FP8-16 3.01 TFLOPS Tensor FP8-32 3.01 TFLOPS
-	Tensor FP16-16 1.5 TFLOPS Tensor FP16-32 1.5 TFLOPS
FP32 921.6 GFLOPS	FP32 1.5 TFLOPS
FP64 230.4 GFLOPS	-
Pixel Rate 7.2 GPixel/s	Pixel Rate 23.5 GPixel/s
Texture Rate 57.6 GTexel/s	Texture Rate 47 GTexel/s

Core Config

Shaders 384 Shaders	Shaders 512 Shaders
TMUs 48 TMUs	TMUs 32 TMUs
ROPs 6 ROPs	ROPs 16 ROPs
Tensor Cores -	Tensor Cores 4 T-Cores
RT Cores -	RT Cores 4 RT-Cores
EUs 48 EUs	EUs 64 EUs

Clocks

Base Clock 300MHz	Base Clock -
Boost Clock 1.2GHz	Boost Clock 1.47GHz

Cache

L2 Cache -

L2 Cache 1MB shared

Memory

Shared Memory DDR4·LPDDR3	Shared MemoryLPDDR5X
Memory Bus 128-bit	Memory Bus 64-bit
Memory Speed 2.7GT/s	Memory Speed 8.5GT/s
Memory Bandwidth 42.7GB/s	Memory Bandwidth 68.3GB/s

Video Output

Multi-Monitor 3

Multi-Monitor 1

Encoder

Encoder Model Quick Sync Video 6

Encoder Model Apple Media Engine 3

Decoder

Decoder Model Quick Sync Video 6

Decoder Model Apple Media Engine 3

Card

Form Factor iGPU

Form Factor iGPU

Chip

Manufacturer Intel	Manufacturer Apple
Chip Designer Intel	Chip Designer Apple
Architecture Gen 9.5	Architecture Apple Gen 8
Family Gen 9.5	Family A Series
Branding	Branding
Codename Coffee Lake	Codename G18A
Chip Variant GT2	Chip Variant -
Market Segment Laptop	Market Segment Smartphone
Release Date Apr 5, 2018	Release Date Mar 2, 2026

Fabrication

Foundry Intel	Foundry TSMC
Fabrication Node 14nm++	Fabrication Node N3P
Die Size 148mm²	Die Size 83mm²
Transistor Count 2.5 Billion	Transistor Count 14.3 Billion
Transistor Density 17 MTr/mm²	Transistor Density 172 MTr/mm²

Images

No images available

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Used In

CPUs Core i7-8559U Core i7-8569U	CPUs A19 (17e)
Laptops MacBook Pro 13(Four Ports, Mid 2018)MacBook Pro 13(Four Ports, Mid 2019)	Laptops -
Smartphones -	Smartphones iPhone 17e

Competitors

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