MSI GeForce RTX 3050 LP 6G OC vs NVIDIA GeForce GTX 660 Full Specs
2,304 Shaders 1.49GHz | 960 Shaders 1.08GHz |
6GB GDDR6168GB/s | 2GB GDDR5144.2GB/s |
·· 6.88 TFLOPS | ·· 2.08 TFLOPS |
Form Factor PCIe Card | Form Factor PCIe Card |
TDP 70W | TDP 140W |
Power Connectors - | Power Connectors 1x 6-Pin |
GeForce RTX 3050 LP 6G OC220 TOPSINT4 Tensor Sparse
GeForce GTX 6602.08 TFLOPSFP32Clock Speed ··· | Clock Speed ··· |
Peak OPS 220 TOPSINT4 Tensor Sparse | Peak OPS 2.08 TFLOPSFP32 |
Tensor FP16-16 27.5 TFLOPSFP16-16 Tensor Sparse 55 TFLOPSTensor FP16-32 13.75 TFLOPSFP16-32 Tensor Sparse 27.5 TFLOPS | - |
BF16 6.88 TFLOPSTensor BF16 13.75 TFLOPSBF16 Tensor Sparse 27.5 TFLOPS | - |
Tensor TF32 6.88 TFLOPS | Tensor TF32 - |
FP32 6.88 TFLOPS | FP32 2.08 TFLOPS |
FP64 107.4 GFLOPS | FP64 86.72 GFLOPS |
Tensor INT4 110 TOPS | Tensor INT4 - |
Tensor INT8 55 TOPS | - |
Ray 10.37 TOPS | Ray - |
Pixel Rate 47.7 GPixel/s | Pixel Rate 26 GPixel/s |
Texture Rate 107.4 GTexel/s | Texture Rate 86.7 GTexel/s |
Shaders 2,304 Shaders | Shaders 960 Shaders |
TMUs 72 TMUs | TMUs 80 TMUs |
ROPs 32 ROPs | ROPs 24 ROPs |
Tensor Cores 72 T-Cores | Tensor Cores - |
RT Cores 18 RT-Cores | RT Cores - |
SMs 18 SMs | SMs 5 SMs |
Base Clock 1.04GHz | Base Clock 980MHz |
Boost Clock 1.49GHz | Boost Clock 1.08GHz |
L2 Cache 2MB shared | L2 Cache 512KB shared |
6GB GDDR6 | 2GB GDDR5 |
Memory Bus 96-bit | Memory Bus 192-bit |
Memory Speed 14GT/s | Memory Speed 6GT/s |
Memory Bandwidth 168GB/s | Memory Bandwidth 144.2GB/s |
ECC No | ECC No |
TDP 70W | TDP 140W |
Multi-Monitor 3 | Multi-Monitor 3 |
HDCP HDCP 2.3 | HDCP - |
1x DisplayPort 1.4 | - |
- | 1x DisplayPort 1.2 |
2x HDMI 2.1 | - |
- | 1x HDMI 1.4 |
- | 1x DVI-D Dual-Link |
- | 1x DVI-I Dual-Link |
Encoder Model NVENC 7 | Encoder Model NVENC 1 |
Decoder Model NVDEC 5 | Decoder Model NVDEC 1 |
Form Factor PCIe Card | Form Factor PCIe Card |
PCIe 2-Slots | PCIe 2-Slots |
Height 69 mm (2.72")Width 174 mm (6.85")Depth 40 mm (1.57") | Height 111 mm (4.37")Width 241 mm (9.49")Depth 38 mm (1.5") |
Cooling Open-Air 2x Fans | Cooling Blower 1x Fan |
Power Connectors - | Power Connectors 1x 6-Pin |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding  | Branding  |
Codename NV177 | Codename NVE6 |
Chip Variant GA107-140-A1 | Chip Variant - |
Market Segment Desktop | Market Segment Desktop |
Release Date Feb 2, 2024 | Release Date Sep 13, 2012 |
Foundry Samsung | Foundry TSMC |
Fabrication Node 8N | Fabrication Node 28nm |
Die Size 200mm² | Die Size 221mm² |
Transistor Count 8.7 Billion | Transistor Count 2.5 Billion |
Transistor Density 43.5 MTr/mm² | Transistor Density 11.49 MTr/mm² |
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