MSI GeForce RTX 3050 LP 6G OC vs XFX Radeon RX 6400 Speedster SWFT 105 Full Specs
2,304 Shaders 1.49GHz | 768 Shaders 2.32GHz |
6GB GDDR6168GB/s | 4GB GDDR6112GB/s |
·· 6.88 TFLOPS | ·· 3.56 TFLOPS |
Form Factor PCIe Card | Form Factor PCIe Card |
TDP 70W | TDP 53W |
Clock Speed ··· | Clock Speed ··· |
Peak OPS 220 TOPSINT4 Tensor Sparse | Peak OPS 7.13 TFLOPSFP16 |
Tensor FP16-16 27.5 TFLOPSFP16-16 Tensor Sparse 55 TFLOPSTensor FP16-32 13.75 TFLOPSFP16-32 Tensor Sparse 27.5 TFLOPS | - |
BF16 6.88 TFLOPSTensor BF16 13.75 TFLOPSBF16 Tensor Sparse 27.5 TFLOPS | - |
Tensor TF32 6.88 TFLOPS | Tensor TF32 - |
FP32 6.88 TFLOPS | FP32 3.56 TFLOPS |
FP64 107.4 GFLOPS | FP64 222.8 GFLOPS |
Tensor INT4 110 TOPS | Tensor INT4 - |
Tensor INT8 55 TOPS | - |
Ray 10.37 TOPS | Ray - |
Pixel Rate 47.7 GPixel/s | Pixel Rate 74.3 GPixel/s |
Texture Rate 107.4 GTexel/s | Texture Rate 111.4 GTexel/s |
Shaders 2,304 Shaders | Shaders 768 Shaders |
TMUs 72 TMUs | TMUs 48 TMUs |
ROPs 32 ROPs | ROPs 32 ROPs |
Tensor Cores 72 T-Cores | Tensor Cores - |
RT Cores 18 RT-Cores | RT Cores 12 RT-Cores |
SMs 18 SMs | CUs 12 CUs |
Base Clock 1.04GHz | Base Clock 2.04GHz |
Boost Clock 1.49GHz | Boost Clock 2.32GHz |
L2 Cache 2MB shared | L2 Cache 1MB shared |
L3 Cache - | L3 Cache 8MB shared |
L3 Bandwidth - | L3 Bandwidth 208GB/s |
6GB GDDR6 | 4GB GDDR6 |
Memory Bus 96-bit | Memory Bus 64-bit |
Memory Speed 14GT/s | Memory Speed 14GT/s |
Memory Bandwidth 168GB/s | Memory Bandwidth 112GB/s |
ECC No | ECC No |
TDP 70W | TDP 53W |
Max Temp - | Max Temp 110°C Max |
Multi-Monitor 3 | Multi-Monitor 2 |
HDCP HDCP 2.3 | HDCP HDCP 2.3 |
1x DisplayPort 1.4 | 1x DisplayPort 1.4 |
2x HDMI 2.1 | 1x HDMI 2.1 |
Encoder Model NVENC 7 | - |
Decoder Model NVDEC 5 | Decoder Model VCN 3.0 |
Form Factor PCIe Card | Form Factor PCIe Card |
PCIe 2-Slots | PCIe 0.7-Slots |
Height 69 mm (2.72")Width 174 mm (6.85")Depth 40 mm (1.57") | Height 68 mm (2.68")Width 155 mm (6.1")Depth 15 mm (0.59") |
Cooling Open-Air 2x Fans | Cooling Open-Air 1x Fan |
Manufacturer | Manufacturer |
Chip Designer | Chip Designer |
Architecture | Architecture |
Family | Family |
Branding ![]() | Branding ![]() |
Codename NV177 | Codename Beige Goby |
Chip Variant GA107-140-A1 | Chip Variant Navi 24 XL |
Market Segment Desktop | Market Segment Desktop |
Release Date Feb 2, 2024 | Release Date Apr 20, 2022 |
Foundry Samsung | Foundry TSMC |
Fabrication Node 8N | Fabrication Node N6 |
Die Size 200mm² | Die Size 107mm² |
Transistor Count 8.7 Billion | Transistor Count 5.4 Billion |
Transistor Density 43.5 MTr/mm² | Transistor Density 50.47 MTr/mm² |
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